EP 2883241 A4 20160323 - METHOD OF PRODUCING SEMICONDUCTOR SUBSTRATE PRODUCT AND ETCHING LIQUID
Title (en)
METHOD OF PRODUCING SEMICONDUCTOR SUBSTRATE PRODUCT AND ETCHING LIQUID
Title (de)
VERFAHREN ZUR HERSTELLUNG EINES HALBLEITERSUBSTRATPRODUKTS UND EINER ÄTZFLÜSSIGKEIT
Title (fr)
PROCÉDÉ DE PRODUCTION D'UN PRODUIT CONSTITUÉ D'UN SUBSTRAT SEMI-CONDUCTEUR ET LIQUIDE DE GRAVURE
Publication
Application
Priority
- JP 2012179042 A 20120810
- JP 2012283429 A 20121226
- JP 2013070675 W 20130724
Abstract (en)
[origin: WO2014024737A1] A method of producing a semiconductor substrate product, having the steps of: providing a semiconductor substrate having two or more impurity-containing silicon layers and a silicon oxide layer, each of the impurity-containing silicon layers containing a different impurity from one another; applying an etching liquid onto the semiconductor substrate, the etching liquid comprising water, a hydrofluoric acid compound, and an anionic compound; and selectively etching the silicon oxide layer.
IPC 8 full level
H01L 21/311 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01)
CPC (source: EP)
H01L 21/31111 (2013.01); H01L 29/66545 (2013.01); H01L 29/66537 (2013.01); H01L 29/6659 (2013.01); H01L 29/7833 (2013.01); H01L 29/7848 (2013.01)
Citation (search report)
- [XI] DE 2529865 A1 19770120 - IBM DEUTSCHLAND
- [XI] WO 2012023387 A1 20120223 - MITSUBISHI GAS CHEMICAL CO [JP], et al
- [X] WO 2006124201 A2 20061123 - SACHEM INC [US], et al
- [X] JP 2006278983 A 20061012 - DAIKIN IND LTD
- [X] JP S6046913 A 19850314 - MATSUSHITA ELECTRIC IND CO LTD
- [X] WO 2010039936 A2 20100408 - ADVANCED TECH MATERIALS [US], et al
- [X] EP 0805484 A1 19971105 - DAIKIN IND LTD [JP]
- [X] US 2012070998 A1 20120322 - LIM JUNG HUN [KR], et al
- [A] US 2005017319 A1 20050127 - MANABE KENZO [JP], et al
- [A] US 2004124492 A1 20040701 - MATSUO KOUJI [JP]
- See references of WO 2014024737A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2014024737 A1 20140213; EP 2883241 A1 20150617; EP 2883241 A4 20160323; JP 2014057039 A 20140327; TW 201412948 A 20140401; TW I625382 B 20180601
DOCDB simple family (application)
JP 2013070675 W 20130724; EP 13827735 A 20130724; JP 2012283429 A 20121226; TW 102127194 A 20130730