EP 2883649 B1 20170419 - HIGH-TEMPERATURE LEAD-FREE SOLDER ALLOY
Title (en)
HIGH-TEMPERATURE LEAD-FREE SOLDER ALLOY
Title (de)
BLEIFREIE HOCHTEMPERATURLÖTLEGIERUNG
Title (fr)
ALLIAGE DE SOUDAGE SANS PLOMB À HAUTE TEMPÉRATURE
Publication
Application
Priority
- JP 2012178846 A 20120810
- JP 2013070473 W 20130729
Abstract (en)
[origin: EP2883649A1] Provided is a high-temperature lead-free solder alloy having excellent tensile strength and elongation in a high-temperature environment of 250°C. In order to make the structure of an Sn-Sb-Ag-Cu solder alloy finer and cause stress applied to the solder alloy to disperse, at least one material selected from the group consisting of, in mass%, 0.003 to 1.0% of Al, 0.01 to 0.2% of Fe, and 0.005 to 0.4% of Ti is added to a solder alloy containing 35 to 40% of Sb, 8 to 25% of Ag, and 5 to 10% of Cu, with the remainder made up by Sn.
IPC 8 full level
B23K 35/26 (2006.01); B23K 1/00 (2006.01); B23K 35/02 (2006.01); B23K 35/22 (2006.01); B23K 35/28 (2006.01); C22C 12/00 (2006.01); C22C 13/02 (2006.01); C22C 30/02 (2006.01); C22C 30/04 (2006.01); C22C 30/06 (2006.01); H05K 3/34 (2006.01); B23K 101/40 (2006.01)
CPC (source: CN EP KR US)
B23K 1/0016 (2013.01 - CN EP US); B23K 35/025 (2013.01 - CN EP KR US); B23K 35/26 (2013.01 - CN EP US); B23K 35/262 (2013.01 - CN EP KR US); B23K 35/28 (2013.01 - EP US); C22C 12/00 (2013.01 - EP US); C22C 13/02 (2013.01 - KR US); C22C 30/02 (2013.01 - CN EP US); C22C 30/04 (2013.01 - CN EP US); C22C 30/06 (2013.01 - US); H05K 3/3463 (2013.01 - CN EP US); B23K 2101/40 (2018.07 - CN EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2883649 A1 20150617; EP 2883649 A4 20160309; EP 2883649 B1 20170419; BR 112015002414 A2 20180206; BR 112015002414 B1 20191001; CN 104520062 A 20150415; CN 104520062 B 20160106; DK 2883649 T3 20170619; ES 2632605 T3 20170914; JP 5585746 B2 20140910; JP WO2014024715 A1 20160725; KR 101561894 B1 20151020; KR 20150024441 A 20150306; MY 154606 A 20150701; TW 201411652 A 20140316; TW I587316 B 20170611; US 2015217410 A1 20150806; US 9796053 B2 20171024; WO 2014024715 A1 20140213
DOCDB simple family (application)
EP 13828210 A 20130729; BR 112015002414 A 20130729; CN 201380042579 A 20130729; DK 13828210 T 20130729; ES 13828210 T 20130729; JP 2013070473 W 20130729; JP 2014510997 A 20130729; KR 20157003260 A 20130729; MY PI2015000346 A 20130729; TW 102128290 A 20130807; US 201314420413 A 20130729