EP 2888019 A1 20150701 - MODULAR ELECTRONIC BUILDING SYSTEMS WITH MAGNETIC INTERCONNECTIONS AND METHODS OF USING THE SAME
Title (en)
MODULAR ELECTRONIC BUILDING SYSTEMS WITH MAGNETIC INTERCONNECTIONS AND METHODS OF USING THE SAME
Title (de)
MODULARE ELEKTRONISCHE GEBÄUDESYSTEME MIT MAGNETISCHEN VERBINDUNGEN UND ANWENDUNGSVERFAHREN DAFÜR
Title (fr)
SYSTÈMES DE CONSTRUCTION ÉLECTRONIQUE MODULAIRES AVEC INTERCONNEXIONS MAGNÉTIQUES ET PROCÉDÉS ASSOCIÉS
Publication
Application
Priority
- US 201213593891 A 20120824
- US 201261728103 P 20121119
- US 2013056599 W 20130826
Abstract (en)
[origin: WO2014032043A1] Electrical connectors, electrical modules, and systems are provided. In one aspect, an electrical connector includes a housing defining a side surface, an electrical conductor supported by the housing and including an engagement portion proximate the side surface of the housing. The engagement portion is adapted to engage another electrical conductor of another electrical connector. The connector also includes a magnet supported by the housing proximate the side surface of the housing, a projection extending from the side surface of the housing, and a receptacle defined in the side surface of the housing. In other aspects, an electrical module includes at least one of these electrical connectors. In further aspects, a system includes a plurality of these modules and the modules are selectively couplable together.
IPC 8 full level
A63H 33/08 (2006.01); A63H 33/04 (2006.01)
CPC (source: CN EP RU)
A63H 33/042 (2013.01 - CN EP); A63H 33/046 (2013.01 - CN); A63H 33/08 (2013.01 - RU); H01R 12/00 (2013.01 - RU); H01R 13/00 (2013.01 - RU); A63H 33/046 (2013.01 - EP)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
WO 2014032043 A1 20140227; AU 2013305556 A1 20150305; AU 2013305556 B2 20180315; AU 2018203907 A1 20180621; AU 2018203907 B2 20200402; AU 347408 S 20130304; BR 112015003911 A2 20170704; BR 112015003911 A8 20190806; CA 2883216 A1 20140227; CN 103974753 A 20140806; CN 103974753 B 20160928; CN 106215432 A 20161214; CN 106215432 B 20190927; CN 106215433 A 20161214; CN 106215433 B 20190910; CN 106267846 A 20170104; CN 106267846 B 20191122; CN 110465103 A 20191119; CN 110465103 B 20221004; EP 2888019 A1 20150701; EP 2888019 A4 20160323; EP 2888019 B1 20181031; EP 3470127 A1 20190417; EP 3470127 B1 20201014; HK 1200136 A1 20150731; JP 2015526208 A 20150910; JP 2019181269 A 20191024; KR 20150086231 A 20150727; MX 2015002306 A 20150810; MX 2020012141 A 20210129; NZ 704976 A 20180126; RU 2015110259 A 20161010; RU 2019111471 A 20191003; RU 2686521 C2 20190429; SG 11201501308P A 20150330
DOCDB simple family (application)
US 2013056599 W 20130826; AU 201310848 F 20130222; AU 2013305556 A 20130826; AU 2018203907 A 20180602; BR 112015003911 A 20130826; CA 2883216 A 20130826; CN 201380004224 A 20130826; CN 201610730917 A 20130826; CN 201610738594 A 20130826; CN 201610740452 A 20130826; CN 201910759040 A 20130826; EP 13831481 A 20130826; EP 18184425 A 20130826; HK 15100629 A 20150120; JP 2015528712 A 20130826; JP 2019141870 A 20190801; KR 20157007424 A 20130826; MX 2015002306 A 20130826; MX 2020012141 A 20150220; NZ 70497613 A 20130826; RU 2015110259 A 20130826; RU 2019111471 A 20130826; SG 11201501308P A 20130826