EP 2896070 A2 20150722 - METHOD FOR IMPROVING THE ADHESION OF PLATED METAL LAYERS TO SILICON
Title (en)
METHOD FOR IMPROVING THE ADHESION OF PLATED METAL LAYERS TO SILICON
Title (de)
VERFAHREN ZUR VERBESSERUNG DER HAFTUNG VON PLATTIERTEN METALLSCHICHTEN AUF SILICIUM
Title (fr)
PROCÉDÉ D'AMÉLIORATION DE L'ADHÉSION DE COUCHES DE MÉTAL PLAQUÉ SUR DU SILICIUM
Publication
Application
Priority
- US 201261701843 P 20120917
- EP 2013067450 W 20130822
Abstract (en)
[origin: WO2014040834A2] A method is disclosed for fabricating photovoltaic cells, the method comprising providing plated metal contacts with a contact pattern comprising a plurality of fingers and at least one first pinning element at the free ends of each of the plurality of fingers; and associated photovoltaic cells.
IPC 8 full level
H01L 31/0224 (2006.01)
CPC (source: CN EP)
H01L 31/022433 (2013.01 - CN EP); H01L 31/0504 (2013.01 - CN EP); H01L 31/18 (2013.01 - CN EP); Y02E 10/50 (2013.01 - EP)
Citation (search report)
See references of WO 2014040834A2
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
WO 2014040834 A2 20140320; WO 2014040834 A3 20140626; CN 104603956 A 20150506; EP 2896070 A2 20150722; JP 2015528645 A 20150928
DOCDB simple family (application)
EP 2013067450 W 20130822; CN 201380046688 A 20130822; EP 13753849 A 20130822; JP 2015531510 A 20130822