EP 2898121 A1 20150729 - ELECTROLYTE AND METHOD FOR ELECTRODEPOSITING COPPER ONTO A BARRIER LAYER
Title (en)
ELECTROLYTE AND METHOD FOR ELECTRODEPOSITING COPPER ONTO A BARRIER LAYER
Title (de)
ELEKTROLYT UND VERFAHREN ZUR GALVANISCHEN ABSCHEIDUNG VON KUPFER AUF EINER BARRIERESCHICHT
Title (fr)
ELECTROLYTE ET PROCÉDÉ D'ÉLECTRODÉPOSITION DE CUIVRE SUR UNE COUCHE BARRIÈRE
Publication
Application
Priority
- FR 1258925 A 20120924
- FR 2013051987 W 20130828
Abstract (en)
[origin: WO2014044942A1] The present invention concerns an electrolyte composition for depositing copper onto semi-conductive substrates covered with a barrier layer. This electrolyte contains a combination of imidazole and 2,2'-bipyridine, used as a suppressor, and thiodiglycolic acid, used as an accelerator. The combination of these additives makes it possible to obtain bottom-up filling on very narrow trenches, typically narrower than 100 nm.
IPC 8 full level
CPC (source: CN EP US)
C25D 3/38 (2013.01 - CN EP US); C25D 7/12 (2013.01 - CN EP US); C25D 7/123 (2013.01 - CN EP US)
Citation (search report)
See references of WO 2014044942A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
WO 2014044942 A1 20140327; CA 2885231 A1 20140327; CN 104685107 A 20150603; CN 104685107 B 20170503; EP 2898121 A1 20150729; EP 2898121 B1 20160803; EP 2898121 B8 20160914; FR 2995912 A1 20140328; FR 2995912 B1 20141010; IL 237731 B 20180430; JP 2015533946 A 20151126; JP 6218837 B2 20171025; KR 102206291 B1 20210122; KR 20150056655 A 20150526; SG 11201502044V A 20150528; TW 201418528 A 20140516; TW I592522 B 20170721; US 10472726 B2 20191112; US 2015218724 A1 20150806
DOCDB simple family (application)
FR 2013051987 W 20130828; CA 2885231 A 20130828; CN 201380049746 A 20130828; EP 13767028 A 20130828; FR 1258925 A 20120924; IL 23773115 A 20150312; JP 2015532481 A 20130828; KR 20157010506 A 20130828; SG 11201502044V A 20130828; TW 102132058 A 20130905; US 201314429584 A 20130828