EP 2898528 A1 20150729 - MOULDING METHOD FOR PRODUCING AN ELECTRONIC HOUSING
Title (en)
MOULDING METHOD FOR PRODUCING AN ELECTRONIC HOUSING
Title (de)
FORMVERFAHREN ZUR HERSTELLUNG ELEKTRONIKGEHÄUSE
Title (fr)
PROCEDE DE MOULAGE POUR FABRIQUER UN BOITIER ELECTRONIQUE
Publication
Application
Priority
- EP 12306128 A 20120918
- EP 2013069297 W 20130917
- EP 13762853 A 20130917
Abstract (en)
[origin: EP2709143A1] The method involves supplying a set of conductive metallizations including beaches and/or circuit conducting tracks on a side of a support (5). A chip (2) is connected to each of the set of metallizations. The chip is molded on the support with an insulating molding material (7) to build a case. The case is separated from the support. A side of the support is arranged in contact with the metallizations comprising adhesive that is liable to deteriorate, where molding of the chip is carried out according to final dimension of an electronic package (1) such as smart card module. An independent claim is also included for a molding equipment.
IPC 8 full level
H01L 21/56 (2006.01); H01L 23/31 (2006.01)
CPC (source: EP US)
H01L 21/4803 (2013.01 - US); H01L 21/565 (2013.01 - EP US); H01L 21/568 (2013.01 - EP US); H01L 23/3107 (2013.01 - EP US); H01L 24/97 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/73265 (2013.01 - EP US); H01L 2924/12042 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US)
Citation (search report)
See references of WO 2014044684A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 2709143 A1 20140319; EP 2898528 A1 20150729; US 2015228505 A1 20150813; WO 2014044684 A1 20140327
DOCDB simple family (application)
EP 12306128 A 20120918; EP 13762853 A 20130917; EP 2013069297 W 20130917; US 201314424124 A 20130917