EP 2901477 A4 20160706 - FLEXIBLE, SPACE-EFFICIENT I/O CIRCUITRY FOR INTEGRATED CIRCUITS
Title (en)
FLEXIBLE, SPACE-EFFICIENT I/O CIRCUITRY FOR INTEGRATED CIRCUITS
Title (de)
FLEXIBLE UND PLATZSPARENDE EINGANGS-/AUSGANGSSCHALTUNG FÜR INTEGRIERTE SCHALTKREISE
Title (fr)
CIRCUITERIE E/S FLEXIBLE ET COMPACTE POUR CIRCUITS INTÉGRÉS
Publication
Application
Priority
- US 201213627270 A 20120926
- US 2013061317 W 20130924
Abstract (en)
[origin: WO2014052274A1] Flexible, space-efficient I/O architectures for integrated circuits simplify circuit design and shorten design times. In one aspect, cells for power supply pads are eliminated, in part by locating ESD protection circuitry for these pads underneath the pads themselves, leaving only signal I/O buffers. Pads coupled to the signal I/O buffers may be defined as either signal I/O pads or power supply pads in accordance with customization circuitry. Customization circuitry provides for flexible bank architectures, where signal I/O buffers within a bank share power supply requirements that may be different from power supply requirements of signal I/O buffers of another bank. The number of banks and the number of signal I/O buffers belonging to each bank is flexibly defined. Customization circuitry provides for flexible pad options, whereby the IC pads may be configured for different packaging technology, for example, for wire bonding for flip-chip bonding, or for other types of bonding.
IPC 8 full level
H01L 21/82 (2006.01); H01L 21/822 (2006.01); H01L 23/00 (2006.01); H01L 23/50 (2006.01); H01L 23/528 (2006.01); H01L 23/60 (2006.01); H01L 27/02 (2006.01); H01L 27/04 (2006.01); H01L 27/118 (2006.01)
CPC (source: CN EP)
H01L 23/60 (2013.01 - CN EP); H01L 24/06 (2013.01 - CN EP); H01L 27/0296 (2013.01 - CN EP); H01L 23/50 (2013.01 - CN EP); H01L 23/5286 (2013.01 - CN EP); H01L 27/11898 (2013.01 - CN EP); H01L 2224/0401 (2013.01 - CN EP); H01L 2224/04042 (2013.01 - CN EP); H01L 2224/05552 (2013.01 - CN EP); H01L 2224/05553 (2013.01 - EP); H01L 2224/05554 (2013.01 - EP); H01L 2224/06133 (2013.01 - CN EP)
Citation (search report)
- [XI] US 2007267748 A1 20071122 - TRAN TU-ANH N [US], et al
- [I] US 2010237509 A1 20100923 - WU JENG-HUANG [TW], et al
- [I] US 2008111255 A1 20080515 - MATSUOKA DAISUKE [JP]
- [I] US 2010155845 A1 20100624 - TOBA TAKEO [JP], et al
- [A] US 7932744 B1 20110426 - GREENE JONATHAN W [US], et al
- See references of WO 2014052274A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2014052274 A1 20140403; CN 104781924 A 20150715; EP 2901477 A1 20150805; EP 2901477 A4 20160706; JP 2015532530 A 20151109; KR 20150058273 A 20150528
DOCDB simple family (application)
US 2013061317 W 20130924; CN 201380050485 A 20130924; EP 13842574 A 20130924; JP 2015534591 A 20130924; KR 20157008651 A 20130924