Global Patent Index - EP 2901714 A1

EP 2901714 A1 20150805 - EMBEDDED CIRCUIT IN A MEMS DEVICE

Title (en)

EMBEDDED CIRCUIT IN A MEMS DEVICE

Title (de)

EINGEBETTETE SCHALTUNG IN EINER MEMS-VORRICHTUNG

Title (fr)

CIRCUIT INTÉGRÉ DANS UN DISPOSITIF MEMS

Publication

EP 2901714 A1 20150805 (EN)

Application

EP 13842019 A 20130926

Priority

  • US 201261706350 P 20120927
  • US 2013061873 W 20130926

Abstract (en)

[origin: WO2014052559A1] A Microelectromechanical System (MEMS) microphone includes a printed circuit board, a MEMS die, and an integrated circuit. The MEMS die disposed on a top surface of the printed circuit board. The integrated circuit is disposed at least partially within the printed circuit board and produces at least one output signal. The at least one output signal of the integrated circuit is routed directly into at least one conductor to access pads at the printed circuit board. The access pads are disposed on a bottom surface of the printed circuit board that is opposite the top surface. The integrated circuit includes conductive pads and an interface layer is disposed between the conductive pads of the integrated circuit and the printed circuit board.

IPC 8 full level

H01L 29/84 (2006.01); H04R 1/04 (2006.01); H04R 19/00 (2006.01); H04R 19/04 (2006.01); H04R 31/00 (2006.01)

CPC (source: EP)

H04R 1/04 (2013.01); H04R 19/005 (2013.01); H04R 19/04 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/20 (2013.01); H01L 2224/24145 (2013.01); H01L 2224/2518 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73267 (2013.01); H01L 2924/15151 (2013.01); H04R 31/00 (2013.01)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

WO 2014052559 A1 20140403; CN 104756523 A 20150701; CN 104756523 B 20180116; EP 2901714 A1 20150805; EP 2901714 A4 20160608; JP 2015532548 A 20151109; KR 20150058467 A 20150528

DOCDB simple family (application)

US 2013061873 W 20130926; CN 201380050551 A 20130926; EP 13842019 A 20130926; JP 2015534645 A 20130926; KR 20157010272 A 20130926