EP 2901714 A4 20160608 - EMBEDDED CIRCUIT IN A MEMS DEVICE
Title (en)
EMBEDDED CIRCUIT IN A MEMS DEVICE
Title (de)
EINGEBETTETE SCHALTUNG IN EINER MEMS-VORRICHTUNG
Title (fr)
CIRCUIT INTÉGRÉ DANS UN DISPOSITIF MEMS
Publication
Application
Priority
- US 201261706350 P 20120927
- US 2013061873 W 20130926
Abstract (en)
[origin: WO2014052559A1] A Microelectromechanical System (MEMS) microphone includes a printed circuit board, a MEMS die, and an integrated circuit. The MEMS die disposed on a top surface of the printed circuit board. The integrated circuit is disposed at least partially within the printed circuit board and produces at least one output signal. The at least one output signal of the integrated circuit is routed directly into at least one conductor to access pads at the printed circuit board. The access pads are disposed on a bottom surface of the printed circuit board that is opposite the top surface. The integrated circuit includes conductive pads and an interface layer is disposed between the conductive pads of the integrated circuit and the printed circuit board.
IPC 8 full level
H04R 1/04 (2006.01); H01L 29/84 (2006.01); H04R 19/00 (2006.01); H04R 19/04 (2006.01); H04R 31/00 (2006.01)
CPC (source: EP)
H04R 1/04 (2013.01); H04R 19/005 (2013.01); H04R 19/04 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/20 (2013.01); H01L 2224/24145 (2013.01); H01L 2224/2518 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73267 (2013.01); H01L 2924/15151 (2013.01); H04R 31/00 (2013.01)
Citation (search report)
- [X] US 2012087521 A1 20120412 - DELAUS MICHAEL D [US], et al
- [I] JP 2012086345 A 20120510 - DAINIPPON PRINTING CO LTD
- [I] US 2011241197 A1 20111006 - THEUSS HORST [DE]
Citation (examination)
- TW 201101851 A 20110101 - MERRY ELECTRONICS CO LTD [TW]
- US 2010195864 A1 20100805 - LUTZ JOSEF [AT], et al
- US 2012020510 A1 20120126 - TANAKA FUMINORI [JP], et al
- US 2011163437 A1 20110707 - SHIN YEE NA [KR], et al
- US 2008007927 A1 20080110 - ITO SOTARO [JP], et al
- US 2004168825 A1 20040902 - SAKAMOTO HAJIME [JP], et al
- See also references of WO 2014052559A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2014052559 A1 20140403; CN 104756523 A 20150701; CN 104756523 B 20180116; EP 2901714 A1 20150805; EP 2901714 A4 20160608; JP 2015532548 A 20151109; KR 20150058467 A 20150528
DOCDB simple family (application)
US 2013061873 W 20130926; CN 201380050551 A 20130926; EP 13842019 A 20130926; JP 2015534645 A 20130926; KR 20157010272 A 20130926