EP 2913847 B1 20180418 - Method of fabricating a semiconductor device and semiconductor product
Title (en)
Method of fabricating a semiconductor device and semiconductor product
Title (de)
Verfahren zur Herstellung eines Halbleiterbauelements und Halbleiterbauelement
Title (fr)
Procédé de fabrication d'un dispositif semi-conducteur et produit à semi-conducteur
Publication
Application
Priority
EP 14157287 A 20140228
Abstract (en)
[origin: EP2913847A1] A method of fabricating a semiconductor product includes the processing of a semiconductor wafer (10) from a front surface including structures disposed in the substrate (100) of the wafer adjacent to the front surface and the forming of at least one wiring (110) embedded in a dielectric layer (111) disposed on the front surface of the wafer. The semiconductor wafer is mounted to a carrier wafer (120) at its front surface so that material can be removed from the backside of the wafer to thin the semiconductor wafer. Backside processing of the semiconductor wafer includes the forming of implantations from the backside of the wafer, the forming of deep trenches (132a, 132b) to isolate the structures from other structures within the wafer, the forming of a through silicon via (134) to contact features on the frontside of the wafer and the forming of a body contact (131). Several devices can be generated within the same wafer.
IPC 8 full level
H01L 21/768 (2006.01); H01L 21/74 (2006.01); H01L 21/762 (2006.01); H01L 21/8234 (2006.01); H01L 29/417 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01)
CPC (source: CN EP KR US)
H01L 21/6835 (2013.01 - EP US); H01L 21/743 (2013.01 - CN EP US); H01L 21/76224 (2013.01 - CN EP US); H01L 21/76898 (2013.01 - CN EP KR US); H01L 21/823418 (2013.01 - CN); H01L 23/5226 (2013.01 - US); H01L 23/528 (2013.01 - US); H01L 23/562 (2013.01 - US); H01L 24/43 (2013.01 - US); H01L 27/0611 (2013.01 - US); H01L 27/092 (2013.01 - US); H01L 27/0922 (2013.01 - EP US); H01L 29/0634 (2013.01 - EP US); H01L 29/0649 (2013.01 - EP US); H01L 29/402 (2013.01 - US); H01L 29/41708 (2013.01 - CN EP US); H01L 29/4175 (2013.01 - KR); H01L 29/41766 (2013.01 - KR); H01L 29/66272 (2013.01 - US); H01L 29/66333 (2013.01 - US); H01L 29/66659 (2013.01 - KR); H01L 29/66681 (2013.01 - US); H01L 29/66696 (2013.01 - KR); H01L 29/66712 (2013.01 - US); H01L 29/732 (2013.01 - CN EP KR US); H01L 29/7395 (2013.01 - US); H01L 29/7398 (2013.01 - KR); H01L 29/74 (2013.01 - KR); H01L 29/7802 (2013.01 - KR); H01L 29/7811 (2013.01 - US); H01L 29/7816 (2013.01 - US); H01L 29/7823 (2013.01 - US); H01L 29/7824 (2013.01 - KR); H01L 29/7835 (2013.01 - KR); H01L 29/808 (2013.01 - CN EP US); H01L 21/823418 (2013.01 - EP US); H01L 21/823871 (2013.01 - EP US); H01L 29/0634 (2013.01 - CN); H01L 29/0649 (2013.01 - CN); H01L 29/0878 (2013.01 - CN EP US); H01L 29/407 (2013.01 - CN EP US); H01L 29/4175 (2013.01 - CN EP US); H01L 29/41766 (2013.01 - CN EP US); H01L 29/66659 (2013.01 - CN EP US); H01L 29/66696 (2013.01 - CN EP US); H01L 29/7398 (2013.01 - CN EP US); H01L 29/74 (2013.01 - CN EP US); H01L 29/7802 (2013.01 - CN EP US); H01L 29/7824 (2013.01 - CN EP US); H01L 29/7835 (2013.01 - CN EP US); H01L 2221/68327 (2013.01 - EP US); H01L 2221/6834 (2013.01 - EP US); H01L 2224/4502 (2013.01 - US); H01L 2924/13055 (2013.01 - EP US); H01L 2924/13091 (2013.01 - EP US)
C-Set (source: EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2913847 A1 20150902; EP 2913847 B1 20180418; CN 106170853 A 20161130; CN 106170853 B 20190910; EP 3373329 A1 20180912; EP 3373329 B1 20230405; EP 3376531 A1 20180919; EP 3376531 B1 20230405; EP 3422415 A1 20190102; EP 3422415 B1 20230802; EP 3422415 C0 20230802; JP 2017507494 A 20170316; JP 6314242 B2 20180418; KR 101932827 B1 20181226; KR 20160134700 A 20161123; US 10002836 B2 20180619; US 2016379936 A1 20161229; WO 2015128479 A1 20150903
DOCDB simple family (application)
EP 14157287 A 20140228; CN 201580010976 A 20150227; EP 18159752 A 20140228; EP 18159759 A 20140228; EP 18159764 A 20140228; EP 2015054170 W 20150227; JP 2016554608 A 20150227; KR 20167026464 A 20150227; US 201515121419 A 20150227