Global Patent Index - EP 2923362 A1

EP 2923362 A1 20150930 - ENAMELLED WIRE

Title (en)

ENAMELLED WIRE

Title (de)

LACKDRAHT

Title (fr)

FIL VERNI

Publication

EP 2923362 A1 20150930 (DE)

Application

EP 13783319 A 20131024

Priority

  • DE 102012111372 A 20121123
  • EP 2013072291 W 20131024

Abstract (en)

[origin: WO2014079647A1] Enamelled wire, particularly enamelled copper wire or enamelled aluminium wire, wherein one surface of a winding wire forming a core of the enamelled wire is completely or substantially completely coated with an electrically insulating varnish consisting of at least one varnish resin. The electrically insulating varnish contains at least one nano filler, wherein the nano filler is formed of a plurality of platelets. A platelet jacket formed by the nano filler completely or substantially completely encloses the winding wire.

IPC 8 full level

H01B 3/30 (2006.01); H01K 3/30 (2006.01)

CPC (source: EP US)

H01B 1/02 (2013.01 - US); H01B 3/002 (2013.01 - US); H01B 3/308 (2013.01 - EP US); H01B 13/0016 (2013.01 - US); Y10T 428/2927 (2015.01 - EP US)

Citation (search report)

See references of WO 2014079647A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

DE 102012111372 A1 20140528; EP 2923362 A1 20150930; EP 2923362 B1 20160921; ES 2608786 T3 20170417; US 2015279507 A1 20151001; WO 2014079647 A1 20140530

DOCDB simple family (application)

DE 102012111372 A 20121123; EP 13783319 A 20131024; EP 2013072291 W 20131024; ES 13783319 T 20131024; US 201314646401 A 20131024