Global Patent Index - EP 2937174 A1

EP 2937174 A1 20151028 - Grinding machine with liquid coolant injection nozzle

Title (en)

Grinding machine with liquid coolant injection nozzle

Title (de)

Schleifmaschine mit Kühlflüssigkeits-Einspritzdüse

Title (fr)

Machine de meulage à buse d'injection de liquide de refroidissement

Publication

EP 2937174 A1 20151028 (EN)

Application

EP 14305617 A 20140425

Priority

EP 14305617 A 20140425

Abstract (en)

This grinding machine (2) for bearing rings includes a frame, a rotating grinding wheel (6) movable in rotation around a first rotation axis and a nozzle (150) adapted to inject (A2) a liquid coolant on a peripheral portion (10) of the grinding wheel. The nozzle (150) is mounted on a first slide (152) movable in translation along a second axis (Y154) perpendicular to the first rotation axis (X6) and the position of the slide along the second axis is controlled by a mechanical linkage (152, 172, 190, 202, 204) connected to a movable part (170) of the machine whose position depends on the outer diameter of the grinding wheel (6).

IPC 8 full level

B24B 5/26 (2006.01); B24B 19/06 (2006.01); B24B 55/02 (2006.01)

CPC (source: EP US)

B24B 19/06 (2013.01 - EP US); B24B 27/0069 (2013.01 - EP US); B24B 41/005 (2013.01 - EP US); B24B 55/02 (2013.01 - EP US)

Citation (applicant)

WO 2008082140 A1 20080710 - SAMSUNG ELECTRONICS CO LTD [KR]

Citation (search report)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

EP 2937174 A1 20151028; CN 105014522 A 20151104; JP 2015208849 A 20151124; US 2015306735 A1 20151029

DOCDB simple family (application)

EP 14305617 A 20140425; CN 201510198441 A 20150424; JP 2015089062 A 20150424; US 201514693105 A 20150422