Global Patent Index - EP 2937175 A1

EP 2937175 A1 20151028 - Grinding machine for bearing rings and method for setting tangency conditions in such a machine

Title (en)

Grinding machine for bearing rings and method for setting tangency conditions in such a machine

Title (de)

Schleifmaschine für Lagerringe und Verfahren zur Einstellung zur Einstellung der Berührungsbedingungen in solch einer Maschine

Title (fr)

Machine de rectification de bagues de roulement et procédé de réglage des conditions de tangence dans une telle machine

Publication

EP 2937175 A1 20151028 (EN)

Application

EP 14305618 A 20140425

Priority

EP 14305618 A 20140425

Abstract (en)

This grinding machine (2) for bearing rings (500) includes a frame, a rotating grinding wheel (6) movable in rotation around a first rotation axis (X6), a working station where a bearing ring stands during a grinding operation of one of its surfaces, a chuck (244) for holding a bearing ring in the working station, this chuck being movable in rotation around a second rotation axis (X24). This machine includes first automatic means to set the position of a shaping tool (12) with respect to an outer peripheral edge (10) of the grinding wheel (6), these first automatic means including an electric motor (702), an encoder (710) coupled to the electric motor to detect a rotation of an output shaft (704) of this motor, a sensor (708) of the position of the shaping tool along a translation axis (Y12) and means (800) to compare an output signal (S 710 ) of the encoder and an output signal (S 708 ) of the sensor. The machine also includes second automatic means to set the axial position of the chuck (244) along the second rotation axis (X24), these second automatic means including an electric motor (902) for driving the chuck in translation (A24) along the second rotation axis and means (910) to detect a rotation of the chuck around the second rotation axis.

IPC 8 full level

B24B 19/06 (2006.01); B24B 27/00 (2006.01); B24B 41/00 (2006.01)

CPC (source: CN EP US)

B24B 19/06 (2013.01 - EP US); B24B 19/11 (2013.01 - CN); B24B 27/0069 (2013.01 - EP US); B24B 41/005 (2013.01 - CN EP US); B24B 41/061 (2013.01 - CN); B24B 49/12 (2013.01 - CN EP US)

Citation (applicant)

WO 2008082140 A1 20080710 - SAMSUNG ELECTRONICS CO LTD [KR]

Citation (search report)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

EP 2937175 A1 20151028; CN 105033819 A 20151111; JP 2015208852 A 20151124; US 2015306725 A1 20151029

DOCDB simple family (application)

EP 14305618 A 20140425; CN 201510201511 A 20150424; JP 2015089065 A 20150424; US 201514693068 A 20150422