Global Patent Index - EP 2941405 A4

EP 2941405 A4 20160914 - HIGH TEMPERATURE SUBSTRATE ATTACHMENT GLASS

Title (en)

HIGH TEMPERATURE SUBSTRATE ATTACHMENT GLASS

Title (de)

GLAS ZUR BEFESTIGUNG EINES HOCHTEMPERATURSUBSTRATS

Title (fr)

VERRE POUR LA FIXATION D'UN SUBSTRAT À TEMPÉRATURE ÉLEVÉE

Publication

EP 2941405 A4 20160914 (EN)

Application

EP 14735110 A 20140104

Priority

  • US 201361749255 P 20130104
  • US 2014010263 W 20140104

Abstract (en)

[origin: US2014193643A1] A method of bonding a first substrate to a second substrate includes providing a glass, applying the glass in a layer between the first and second substrates to form an assembly, and heating the assembly to a bonding temperature above a glass transition temperature of the devitrifying glass, selected to cause the glass to bond the first substrate to the second substrate. The devitrifying glass has constituents that include various amounts of group A in a molar concentration of 70-95%, group B in a molar concentration of 5-20%, group C in a molar concentration of 1-20%, group D in a molar concentration of 0-6%; and group E in a molar concentration of 0-10%. The group A, B, C, D and E groups are disclosed herein.

IPC 8 full level

C03C 3/066 (2006.01); C03C 8/24 (2006.01); C03C 10/00 (2006.01); C03C 17/36 (2006.01)

CPC (source: EP US)

B32B 17/00 (2013.01 - EP US); B32B 17/06 (2013.01 - EP US); C03C 3/066 (2013.01 - EP US); C03C 3/085 (2013.01 - EP US); C03C 3/093 (2013.01 - EP US); C03C 8/24 (2013.01 - EP US); C03C 10/0045 (2013.01 - EP US); C03C 17/3618 (2013.01 - EP US); H01M 8/0282 (2013.01 - US); Y02E 60/50 (2013.01 - EP)

Citation (search report)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

US 2014193643 A1 20140710; US 9415569 B2 20160816; CN 104918894 A 20150916; CN 104918894 B 20190212; EP 2941405 A1 20151111; EP 2941405 A4 20160914; EP 2941405 B1 20180314; KR 20150105320 A 20150916; WO 2014107631 A1 20140710

DOCDB simple family (application)

US 201414147524 A 20140104; CN 201480003838 A 20140104; EP 14735110 A 20140104; KR 20157017882 A 20140104; US 2014010263 W 20140104