EP 2944444 A1 20151118 - Wafer processing method
Title (en)
Wafer processing method
Title (de)
Waferverarbeitungsverfahren
Title (fr)
Procédé de traitement de plaque
Publication
Application
Priority
EP 14168599 A 20140516
Abstract (en)
The invention relates to a wafer processing method performed subsequent to cutting (1), the wafer processing method comprising: a) a step of transporting (2); b) a first wafer processing step comprising charging (4) the wafer receiving container (17) with a first processing fluid (21); c) a step of removing (5) the first processing fluid (21) from the wafer receiving container (17); d) a second wafer processing step by charging (7) the wafer receiving container (17) with a second processing fluid (22), wherein preferably the second processing fluid (22) is different from the first processing fluid (21); wherein the wafer block (16) is accommodated in the wafer receiving container (17) during the steps a) to d) without removing it from the wafer receiving container (17) between those steps.
IPC 8 full level
B28D 5/00 (2006.01); H01L 21/67 (2006.01)
CPC (source: CN EP)
B28D 5/0076 (2013.01 - CN EP); B28D 5/0082 (2013.01 - CN EP)
Citation (applicant)
- CN 201788957 U 20110406 - YUJUN WEIFANG NEW ENERGY TECHNOLOGY LTD
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Citation (search report)
[XDA] EP 2711978 A1 20140326 - MEYER BURGER AG [CH]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 2944444 A1 20151118; CN 106457611 A 20170222; WO 2015173739 A1 20151119
DOCDB simple family (application)
EP 14168599 A 20140516; CN 201580025603 A 20150513; IB 2015053512 W 20150513