EP 2950335 B1 20200826 - SEMICONDUCTOR DEVICE BONDING WIRE
Title (en)
SEMICONDUCTOR DEVICE BONDING WIRE
Title (de)
VERBINDUNGSDRAHT FÜR EINE HALBLEITERVORRICHTUNG
Title (fr)
FIL DE SOUDAGE D'UN DISPOSITIF A SEMI-CONDUCTEUR
Publication
Application
Priority
- JP 2007192193 A 20070724
- EP 08791508 A 20080724
- JP 2008063256 W 20080724
Abstract (en)
[origin: EP2221861A1] It is an object of the present invention to provide a copper-based bonding wire whose material cost is low, having excellent ball bondability, reliability in a heat cycle test or reflow test, and storage life, enabling an application to thinning of a wire used for fine pitch connection. The bonding wire includes a core material having copper as a main component and an outer layer which is provided on the core material and contains a metal M and copper, in which the metal M differs from the core material in one or both of components and composition.. The outer layer is 0.021 to 0.12µm in thickness.
IPC 8 full level
H01B 5/02 (2006.01); H01L 21/60 (2006.01); H01L 23/00 (2006.01); H01L 23/49 (2006.01)
CPC (source: EP KR US)
H01B 5/02 (2013.01 - KR); H01L 24/43 (2013.01 - EP US); H01L 24/45 (2013.01 - EP US); H01L 24/85 (2013.01 - EP US); H01L 24/05 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 2224/04042 (2013.01 - EP US); H01L 2224/05624 (2013.01 - EP US); H01L 2224/4312 (2013.01 - EP US); H01L 2224/4321 (2013.01 - EP US); H01L 2224/43825 (2013.01 - EP US); H01L 2224/43847 (2013.01 - EP US); H01L 2224/43848 (2013.01 - EP US); H01L 2224/43986 (2013.01 - EP US); H01L 2224/45015 (2013.01 - EP US); H01L 2224/45144 (2013.01 - EP US); H01L 2224/45147 (2013.01 - EP US); H01L 2224/45565 (2013.01 - EP US); H01L 2224/45572 (2013.01 - EP US); H01L 2224/456 (2013.01 - EP US); H01L 2224/45639 (2013.01 - EP US); H01L 2224/45644 (2013.01 - EP US); H01L 2224/45655 (2013.01 - EP US); H01L 2224/45664 (2013.01 - EP US); H01L 2224/45669 (2013.01 - EP US); H01L 2224/45671 (2013.01 - EP US); H01L 2224/45673 (2013.01 - EP US); H01L 2224/4568 (2013.01 - EP US); H01L 2224/45684 (2013.01 - EP US); H01L 2224/48011 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2224/48247 (2013.01 - EP US); H01L 2224/4845 (2013.01 - EP US); H01L 2224/48463 (2013.01 - EP US); H01L 2224/48472 (2013.01 - EP US); H01L 2224/48624 (2013.01 - EP US); H01L 2224/48639 (2013.01 - EP US); H01L 2224/48644 (2013.01 - EP US); H01L 2224/48664 (2013.01 - EP US); H01L 2224/48724 (2013.01 - EP US); H01L 2224/48824 (2013.01 - EP US); H01L 2224/48839 (2013.01 - EP US); H01L 2224/48844 (2013.01 - EP US); H01L 2224/48864 (2013.01 - EP US); H01L 2224/78251 (2013.01 - EP US); H01L 2224/78301 (2013.01 - EP US); H01L 2224/85045 (2013.01 - EP US); H01L 2224/85048 (2013.01 - EP US); H01L 2224/85065 (2013.01 - EP US); H01L 2224/85075 (2013.01 - EP US); H01L 2224/85203 (2013.01 - EP US); H01L 2224/85205 (2013.01 - EP US); H01L 2224/85207 (2013.01 - EP US); H01L 2224/85439 (2013.01 - EP US); H01L 2224/85444 (2013.01 - EP US); H01L 2224/85464 (2013.01 - EP US); H01L 2224/859 (2013.01 - EP US); H01L 2924/00011 (2013.01 - EP US); H01L 2924/00015 (2013.01 - EP US); H01L 2924/01004 (2013.01 - EP US); H01L 2924/01005 (2013.01 - US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01007 (2013.01 - EP US); H01L 2924/01013 (2013.01 - US); H01L 2924/01014 (2013.01 - EP US); H01L 2924/01015 (2013.01 - EP US); H01L 2924/01018 (2013.01 - EP US); H01L 2924/01022 (2013.01 - EP US); H01L 2924/01023 (2013.01 - EP US); H01L 2924/01024 (2013.01 - EP US); H01L 2924/01027 (2013.01 - EP US); H01L 2924/01028 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/0104 (2013.01 - EP US); H01L 2924/01042 (2013.01 - EP US); H01L 2924/01045 (2013.01 - EP US); H01L 2924/01046 (2013.01 - EP US); H01L 2924/01047 (2013.01 - EP US); H01L 2924/0105 (2013.01 - EP US); H01L 2924/01058 (2013.01 - EP US); H01L 2924/01074 (2013.01 - EP US); H01L 2924/01077 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01079 (2013.01 - US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/01083 (2013.01 - EP US); H01L 2924/01105 (2013.01 - EP US); H01L 2924/01204 (2013.01 - EP US); H01L 2924/01327 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/10253 (2013.01 - EP US); H01L 2924/12041 (2013.01 - EP US); H01L 2924/15747 (2013.01 - EP US); H01L 2924/20105 (2013.01 - EP US); H01L 2924/20106 (2013.01 - EP US); H01L 2924/20107 (2013.01 - EP US); H01L 2924/20752 (2013.01 - EP US); H01L 2924/20753 (2013.01 - EP US); H01L 2924/20754 (2013.01 - EP US); H01L 2924/20755 (2013.01 - EP US); H01L 2924/20756 (2013.01 - EP US); H01L 2924/20757 (2013.01 - EP US); H01L 2924/20758 (2013.01 - EP US); H01L 2924/20759 (2013.01 - EP US); H01L 2924/3025 (2013.01 - EP US); H01L 2924/3861 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
DOCDB simple family (publication)
EP 2221861 A1 20100825; EP 2221861 A4 20120620; CN 101689517 A 20100331; CN 101689517 B 20121017; CN 102842539 A 20121226; CN 102842539 B 20150624; EP 2312628 A2 20110420; EP 2950335 A2 20151202; EP 2950335 A3 20160330; EP 2950335 B1 20200826; EP 2950335 B8 20201104; EP 2960931 A2 20151230; EP 2960931 A3 20160427; EP 2960931 B1 20200826; EP 2960931 B8 20201104; JP 2010153917 A 20100708; JP 2010153918 A 20100708; JP 2010212697 A 20100924; JP 4542203 B2 20100908; JP 4719299 B2 20110706; JP 4719300 B2 20110706; JP 5627263 B2 20141119; JP WO2009014168 A1 20101007; KR 101030838 B1 20110422; KR 101082280 B1 20111109; KR 101341725 B1 20131216; KR 20090131297 A 20091228; KR 20100114126 A 20101022; KR 20110052724 A 20110518; MY 147804 A 20130121; SG 10201401960R A 20140627; US 2010327450 A1 20101230; US 2012104613 A1 20120503; US 8102061 B2 20120124; US 9112059 B2 20150818; WO 2009014168 A1 20090129
DOCDB simple family (application)
EP 08791508 A 20080724; CN 200880023088 A 20080724; CN 201210313521 A 20080724; EP 10191035 A 20080724; EP 15169502 A 20080724; EP 15169504 A 20080724; JP 2008063256 W 20080724; JP 2009524506 A 20080724; JP 2010073297 A 20100326; JP 2010073298 A 20100326; JP 2010073299 A 20100326; KR 20097025455 A 20080724; KR 20107020084 A 20080724; KR 20117007158 A 20080724; MY PI20100341 A 20080724; SG 10201401960R A 20080724; US 201213349155 A 20120112; US 67025308 A 20080724