Global Patent Index - EP 2957376 B1

EP 2957376 B1 20190227 - Method of forming a bonded article with provision of a porous interlayer region

Title (en)

Method of forming a bonded article with provision of a porous interlayer region

Title (de)

Verfahren zum Herstellen eines verbundenen Artikels unter Verwendung einer poröse Zwischenschichtsregion

Title (fr)

Procédé de réalisation d'un article joint avec la provision d'une region intercouche poreuse

Publication

EP 2957376 B1 20190227 (EN)

Application

EP 15158479 A 20150310

Priority

  • GB 201405988 A 20140403
  • GB 201406527 A 20140411

Abstract (en)

[origin: US2015283642A1] A method of bonding a first article to a second article, each article having a respective bond surface. The method comprises interposing a porous interlayer region between the bond surfaces of the first and second articles and subsequently using electrical resistance heating to locally heat the interlayer region under contact pressure to a bonding temperature below the melting temperature of the interlayer and the first and second articles to thereby bond the interlayer to the first and second articles to form a bonded article. The interlayer has a porosity of between approximately 10% and 30%

IPC 8 full level

B23K 20/02 (2006.01); B22F 3/105 (2006.01); B23K 20/16 (2006.01); B23K 20/233 (2006.01); B23K 20/24 (2006.01); B23K 26/34 (2014.01); B23P 6/00 (2006.01); B23K 101/00 (2006.01); B23K 103/14 (2006.01)

CPC (source: EP US)

B22F 7/004 (2013.01 - EP US); B22F 10/25 (2021.01 - EP US); B22F 10/28 (2021.01 - EP US); B23K 11/02 (2013.01 - US); B23K 11/18 (2013.01 - US); B23K 20/023 (2013.01 - EP US); B23K 20/026 (2013.01 - EP US); B23K 20/16 (2013.01 - EP US); B23K 20/233 (2013.01 - EP US); B23K 20/24 (2013.01 - EP US); B23K 26/34 (2013.01 - EP US); B33Y 10/00 (2014.12 - EP US); B22F 3/1146 (2013.01 - EP US); B22F 10/32 (2021.01 - EP US); B22F 2998/10 (2013.01 - EP US); B23K 2101/001 (2018.07 - EP US); B23K 2103/14 (2018.07 - EP US); B23P 6/005 (2013.01 - EP US); Y02P 10/25 (2015.11 - EP US)

C-Set (source: EP US)

  1. B22F 2998/10 + B22F 3/11 + B22F 10/28
  2. B22F 2998/10 + B22F 3/11 + B22F 10/25

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

US 2015283642 A1 20151008; US 9731377 B2 20170815; EP 2957376 A2 20151223; EP 2957376 A3 20160420; EP 2957376 B1 20190227; GB 201405988 D0 20140521; GB 201406527 D0 20140528

DOCDB simple family (application)

US 201514645956 A 20150312; EP 15158479 A 20150310; GB 201405988 A 20140403; GB 201406527 A 20140411