EP 2959270 A1 20151230 - SENSOR SYSTEM COMPRISING A CERAMIC HOUSING
Title (en)
SENSOR SYSTEM COMPRISING A CERAMIC HOUSING
Title (de)
SENSORSYSTEM MIT KERAMISCHEM GEHÄUSE
Title (fr)
SYSTÈME DE CAPTEUR COMPORTANT UN BOÎTIER CÉRAMIQUE
Publication
Application
Priority
- DE 102013101732 A 20130221
- EP 2013074300 W 20131120
Abstract (en)
[origin: WO2014127861A1] The invention relates to a sensor system comprising a sensor chip (1) which is mounted on a mounting seat (20) of a ceramic housing body (2). The housing body (2) has a three-dimensional, monolithic design and is produced from a ceramic material with a thermal expansion coefficient which, in a temperature range of greater than or equal to -40°C and less than or equal to 150°C, deviates by less than 30% from the thermal expansion coefficient of the sensor chip (1).
IPC 8 full level
G01D 11/24 (2006.01); B81B 7/00 (2006.01); G01D 11/30 (2006.01); H10N 50/80 (2023.01)
CPC (source: EP US)
B81B 7/0048 (2013.01 - EP US); B81C 1/0023 (2013.01 - US); G01D 11/245 (2013.01 - EP US); G01D 11/30 (2013.01 - EP US); H01L 21/56 (2013.01 - US); H01L 23/291 (2013.01 - US); B81B 2207/012 (2013.01 - EP US); B81B 2207/097 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US)
C-Set (source: EP US)
Citation (examination)
EP 2056087 A1 20090506 - PANASONIC ELEC WORKS CO LTD [JP]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DE 102013101732 A1 20140821; CN 105008867 A 20151028; EP 2959270 A1 20151230; JP 2016511401 A 20160414; US 2016013112 A1 20160114; WO 2014127861 A1 20140828
DOCDB simple family (application)
DE 102013101732 A 20130221; CN 201380073579 A 20131120; EP 13799504 A 20131120; EP 2013074300 W 20131120; JP 2015558362 A 20131120; US 201314766405 A 20131120