EP 2961252 A1 20151230 - SYSTEMS AND METHODS FOR PASSIVE COOLING OF COMPONENTS WITHIN ELECTRICAL DEVICES
Title (en)
SYSTEMS AND METHODS FOR PASSIVE COOLING OF COMPONENTS WITHIN ELECTRICAL DEVICES
Title (de)
SYSTEME UND VERFAHREN ZUR PASSIVEN KÜHLUNG VON KOMPONENTEN INNERHALB ELEKTRISCHER VORRICHTUNGEN
Title (fr)
SYSTÈMES ET PROCÉDÉS PERMETTANT LE REFROIDISSEMENT PASSIF DE COMPOSANTS DANS DES DISPOSITIFS ÉLECTRIQUES
Publication
Application
Priority
US 201414316575 A 20140626
Abstract (en)
A system includes an electrical enclosure, a first electrical unit (12), a first electrical module (14), a first heat spreader (76), and a heat sink (44). The first electrical unit (12) is removably disposed within the electrical enclosure, and the first electrical unit (12) includes a first surface opposite to a second surface. The first electrical module is removably disposed within the first electrical unit (12), and the first electrical module is inserted into the first electrical unit (12) in a first direction (36) from the first surface to the second surface. The first heat spreader (76) is coupled to the first electrical module, and the first heat spreader (76) comprises a first tapered coupling. The heat sink (44) includes a second tapered coupling (102). The second tapered coupling (102) is couples with the first tapered coupling of the first heat spreader (76) to form a physical thermal connection that facilitates heat transfer between the first electrical module and the heat sink (44).
IPC 8 full level
H05K 7/20 (2006.01)
CPC (source: EP US)
H05K 7/20409 (2013.01 - US); H05K 7/20545 (2013.01 - EP US); H05K 7/20509 (2013.01 - US)
Citation (search report)
- [A] WO 2008114444 A1 20080925 - FUJITSU LTD [JP], et al
- [A] US 2013194755 A1 20130801 - LING WEI [US], et al
- [A] US 2010020514 A1 20100128 - LEE YING-MING [US], et al
- [A] US 2012170224 A1 20120705 - FOWLER MICHAEL LEE [US], et al
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 2961252 A1 20151230; EP 2961252 B1 20180228; BR 102015015470 A2 20151229; CA 2895388 A1 20151226; CA 2895388 C 20221004; CN 105338790 A 20160217; CN 105338790 B 20200707; US 2015382508 A1 20151231; US 9521782 B2 20161213
DOCDB simple family (application)
EP 15172718 A 20150618; BR 102015015470 A 20150625; CA 2895388 A 20150625; CN 201510775999 A 20150626; US 201414316575 A 20140626