Global Patent Index - EP 2963655 A1

EP 2963655 A1 20160106 - ELECTROCONDUCTIVE MICROPARTICLES, ANISOTROPIC ELECTROCONDUCTIVE MATERIAL, AND ELECTROCONDUCTIVE CONNECTION STRUCTURE

Title (en)

ELECTROCONDUCTIVE MICROPARTICLES, ANISOTROPIC ELECTROCONDUCTIVE MATERIAL, AND ELECTROCONDUCTIVE CONNECTION STRUCTURE

Title (de)

ELEKTRISCH LEITENDE MIKROPARTIKEL, ANISOTROPES ELEKTRISCH LEITENDES MATERIAL UND ELEKTRISCH LEITENDE VERBINDUNGSSTRUKTUR

Title (fr)

MICROPARTICULES ÉLECTROCONDUCTRICES, MATÉRIAU ÉLECTROCONDUCTEUR ANISOTROPE, ET STRUCTURE DE CONNEXION ÉLECTROCONDUCTRICE

Publication

EP 2963655 A1 20160106 (EN)

Application

EP 14756789 A 20140228

Priority

  • JP 2013039800 A 20130228
  • JP 2014055035 W 20140228

Abstract (en)

The present invention aims to provide electroconductive microparticles which are less likely to cause disconnection due to breakage of connection interfaces between electrodes and the electroconductive microparticles even under application of an impact by dropping or the like and are less likely to be fatigued even after repetitive heating and cooling, and an anisotropic electroconductive material and an electroconductive connection structure each produced using the electroconductive microparticles. The present invention relates to electroconductive microparticles each including at least an electroconductive metal layer, a barrier layer, a copper layer, and a solder layer containing tin that are laminated in said order on a surface of a core particle made of a resin or metal, the copper layer and the solder layer being in contact with each other directly, the copper layer directly in contact with the solder layer containing copper at a ratio of 0.5 to 5 % by weight relative to tin contained in the solder layer.

IPC 8 full level

H01B 5/00 (2006.01); B22F 1/17 (2022.01); B22F 1/18 (2022.01); H01B 1/00 (2006.01); H01B 1/22 (2006.01); H01B 5/16 (2006.01); H01R 11/01 (2006.01)

CPC (source: EP US)

B22F 1/17 (2022.01 - EP US); B22F 1/18 (2022.01 - EP US); B23K 35/0244 (2013.01 - EP US); B23K 35/262 (2013.01 - EP US); C22C 13/00 (2013.01 - EP US); C23C 18/1635 (2013.01 - EP US); C23C 18/1651 (2013.01 - EP US); C23C 18/1653 (2013.01 - EP US); C25D 5/12 (2013.01 - EP US); C25D 5/619 (2020.08 - EP US); H01B 1/02 (2013.01 - EP US); H01B 1/22 (2013.01 - US); H01L 24/29 (2013.01 - EP US); H01L 24/83 (2013.01 - EP US); H05K 3/323 (2013.01 - EP US); H01L 24/27 (2013.01 - EP US); H01L 24/32 (2013.01 - EP US); H01L 2224/27003 (2013.01 - EP US); H01L 2224/271 (2013.01 - EP US); H01L 2224/27312 (2013.01 - EP US); H01L 2224/2732 (2013.01 - EP US); H01L 2224/27334 (2013.01 - EP US); H01L 2224/2929 (2013.01 - EP US); H01L 2224/29339 (2013.01 - EP US); H01L 2224/29347 (2013.01 - EP US); H01L 2224/29355 (2013.01 - EP US); H01L 2224/2939 (2013.01 - EP US); H01L 2224/294 (2013.01 - EP US); H01L 2224/29411 (2013.01 - EP US); H01L 2224/29439 (2013.01 - EP US); H01L 2224/29444 (2013.01 - EP US); H01L 2224/29455 (2013.01 - EP US); H01L 2224/29457 (2013.01 - EP US); H01L 2224/29464 (2013.01 - EP US); H01L 2224/29466 (2013.01 - EP US); H01L 2224/29469 (2013.01 - EP US); H01L 2224/29481 (2013.01 - EP US); H01L 2224/29487 (2013.01 - EP US); H01L 2224/32227 (2013.01 - EP US); H01L 2224/83191 (2013.01 - EP US); H01L 2224/834 (2013.01 - EP US); H01L 2224/83447 (2013.01 - EP US); H01L 2224/83815 (2013.01 - EP US); H01L 2224/83851 (2013.01 - EP US); H01L 2924/3512 (2013.01 - EP US); H01L 2924/3651 (2013.01 - EP US); H05K 2201/0218 (2013.01 - EP US); H05K 2201/0221 (2013.01 - EP US); H05K 2203/0425 (2013.01 - EP US)

C-Set (source: EP US)

  1. H01L 2224/29347 + H01L 2924/00014
  2. H01L 2224/29487 + H01L 2924/04941
  3. H01L 2224/29487 + H01L 2924/05342
  4. H01L 2224/29455 + H01L 2924/01015
  5. H01L 2224/29455 + H01L 2924/01005
  6. H01L 2224/29355 + H01L 2924/00014
  7. H01L 2224/294 + H01L 2924/014
  8. H01L 2224/29411 + H01L 2924/01047
  9. H01L 2224/29411 + H01L 2924/01047 + H01L 2924/01051
  10. H01L 2224/29411 + H01L 2924/01047 + H01L 2924/01083
  11. H01L 2224/29411 + H01L 2924/01047 + H01L 2924/01049
  12. H01L 2224/29339 + H01L 2924/00014
  13. H01L 2224/29411 + H01L 2924/01047 + H01L 2924/01032
  14. H01L 2224/29411 + H01L 2924/01047 + H01L 2924/01013
  15. H01L 2224/29411 + H01L 2924/01047 + H01L 2924/0103
  16. H01L 2224/29411 + H01L 2924/01047 + H01L 2924/01028
  17. H01L 2224/29411 + H01L 2924/01047 + H01L 2924/01027
  18. H01L 2224/29411 + H01L 2924/01047 + H01L 2924/01029
  19. H01L 2224/2732 + H01L 2924/00014
  20. H01L 2224/27334 + H01L 2924/00014
  21. H01L 2224/27312 + H01L 2924/00014
  22. H01L 2224/271 + H01L 2924/00014
  23. H01L 2224/29444 + H01L 2924/00014
  24. H01L 2224/83447 + H01L 2924/00014
  25. H01L 2224/834 + H01L 2924/014
  26. H01L 2224/29464 + H01L 2924/00014
  27. H01L 2224/29469 + H01L 2924/00014
  28. H01L 2224/29457 + H01L 2924/00014
  29. H01L 2224/29439 + H01L 2924/00014
  30. H01L 2224/29466 + H01L 2924/00014
  31. H01L 2224/29481 + H01L 2924/00014

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

EP 2963655 A1 20160106; EP 2963655 A4 20161102; EP 2963655 B1 20171227; CN 104937675 A 20150923; CN 104937675 B 20160824; JP 5580954 B1 20140827; JP WO2014133124 A1 20170202; KR 101561418 B1 20151016; KR 20150081368 A 20150713; US 2016005504 A1 20160107; US 9478326 B2 20161025; WO 2014133124 A1 20140904

DOCDB simple family (application)

EP 14756789 A 20140228; CN 201480005809 A 20140228; JP 2014055035 W 20140228; JP 2014511674 A 20140228; KR 20157016027 A 20140228; US 201414768837 A 20140228