Global Patent Index - EP 2977835 B1

EP 2977835 B1 20170628 - Welding by electroforming an electroformed timepiece shell

Title (en)

Welding by electroforming an electroformed timepiece shell

Title (de)

Schweißen durch Elektroformen des Gehäuses einer elektrogeformten Uhr

Title (fr)

Soudure par électro-formage de coque d'horlogerie électro-formée

Publication

EP 2977835 B1 20170628 (FR)

Application

EP 14177777 A 20140721

Priority

EP 14177777 A 20140721

Abstract (en)

[origin: US2016017509A1] Method for manufacturing an electroformed timepiece component: the same first alloy including a first precious metal is selected to make both functional inserts and an electroformed shell; these inserts are made; an electroforming substrate having a complementary profile to the inner profile of this component is formed in a second sacrificial material; these inserts are inserted into housings made on this substrate, to form an equipped sacrificial substrate, which is provided with the resists necessary to obtain, by means of an electroforming process, a bare electroformed component, with deposition of material on this substrate, acting as a core to form this electroformed shell, and on each accessible surface of each insert to secure the insert to this electroformed shell; then this sacrificial substrate is destroyed and all of these resists are removed.

IPC 8 full level

G04B 37/08 (2006.01); G04B 37/22 (2006.01)

CPC (source: EP US)

C25D 1/003 (2013.01 - US); C25D 1/02 (2013.01 - US); C25D 1/08 (2013.01 - US); G04B 37/04 (2013.01 - US); G04B 37/08 (2013.01 - EP US); G04B 37/22 (2013.01 - EP US)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

EP 2977835 A1 20160127; EP 2977835 B1 20170628; CN 105301945 A 20160203; CN 105301945 B 20171017; HK 1218787 A1 20170310; JP 2016024192 A 20160208; JP 6045656 B2 20161214; TW 201616251 A 20160501; TW I657321 B 20190421; US 2016017509 A1 20160121; US 9719182 B2 20170801

DOCDB simple family (application)

EP 14177777 A 20140721; CN 201510427626 A 20150720; HK 16106754 A 20160613; JP 2015141087 A 20150715; TW 104122776 A 20150714; US 201514799874 A 20150715