EP 2978593 B1 20170927 - PRODUCTION OF 3D FREE-FORM WAVEGUIDE STRUCTURES
Title (en)
PRODUCTION OF 3D FREE-FORM WAVEGUIDE STRUCTURES
Title (de)
HERSTELLUNG VON 3D-FREIFORM-WELLENLEITERSTRUKTUREN
Title (fr)
PRODUCTION DE STRUCTURES DE GUIDE D'ONDES TRIDIMENSIONNELLES À FORMES LIBRES
Publication
Application
Priority
- DE 102013005565 A 20130328
- EP 2014000841 W 20140328
Abstract (en)
[origin: WO2014154363A1] The present invention provides a process for producing an optical waveguide (20) more particularly for integrated photonic systems. This process comprises provision of polymerizable material; local polymerization of the polymerizable material to produce a multiplicity of polymerized structural elements (14); removal of the unpolymerized regions of the polymerizable material; and heating of the polymerized material more particularly above the glass transition temperature thereof in order to fuse the multiplicity of polymerized structural elements (14) together to form the optical waveguide (20).
IPC 8 full level
B29C 71/02 (2006.01); B29C 67/00 (2017.01); B29D 11/00 (2006.01); G02B 6/122 (2006.01); G02B 6/138 (2006.01); G02B 6/30 (2006.01); G03F 7/00 (2006.01); G03F 7/038 (2006.01)
CPC (source: EP US)
B29C 64/135 (2017.07 - EP US); B29C 71/02 (2013.01 - EP US); B29D 11/00663 (2013.01 - EP US); G02B 6/1221 (2013.01 - EP US); G02B 6/138 (2013.01 - EP US); G02B 6/305 (2013.01 - EP US); G03F 7/038 (2013.01 - EP US); G03F 7/70375 (2013.01 - EP US); B29C 2071/022 (2013.01 - EP US); B29K 2105/0002 (2013.01 - US); B29L 2011/0075 (2013.01 - US)
Citation (opposition)
Opponent : Multiphoton Optics GmbH
- WO 2014108538 A2 20140717 - FRAUNHOFER GES FORSCHUNG [DE]
- EP 1635202 A1 20060315 - 3M INNOVATIVE PROPERTIES CO [US]
- WO 2009021256 A1 20090219 - AUSTRIA TECH & SYSTEM TECH [AT], et al
- EP 1846527 B1 20080806 - 3M INNOVATIVE PROPERTIES CO [US]
- DE 102007038642 B4 20110630 - BUNDESREP DEUTSCHLAND [DE]
- J. SERBIN ET AL.: "Three-dimensional nanostructuring of hybrid materials by two-photon polymerization SPIE Nanocrystals", ORGANIC AND HYBRID NANOMATERIALS, vol. 4, 2003, San Diego, pages 171 - 177, XP055512777
- RUTH HOUBERTZ ET AL.: "Advanced packaging materials for optical applications: bridging the gap between nm-size structures and large-area panel processing", PROC. SPIE 6126, PHOTONICS PACKAGING AND INTEGRATION VI, vol. 612605, 28 February 2006 (2006-02-28), XP055468518
- HOUBERTZ, R. ET AL.: "Optical Waveguides Embedded in PCBs - A Real World Application of 3D Structures Written by TPA", MRS PROCEEDINGS, vol. 1054, 2007, XP055512781, [retrieved on 20110201]
- N. LINDENMANN ET AL.: "Photonic wire bonding: a novel concept for chip-scale interconnects", OPT. EXPRESS, vol. 20, no. 16, 2012, pages 17667 - 17677, XP002729710
- TANAKA ET AL.: "Rapid sub-diffraction-limit laser micro/nanoprocessing in a threshold material system", APPLIED PHYSICS LETTERS, vol. 80, no. 2, 14 January 2002 (2002-01-14), pages 312 - 314, XP012030919
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
DE 102013005565 A1 20141002; EP 2978593 A1 20160203; EP 2978593 B1 20170927; US 10343332 B2 20190709; US 2016046070 A1 20160218; WO 2014154363 A1 20141002
DOCDB simple family (application)
DE 102013005565 A 20130328; EP 14714177 A 20140328; EP 2014000841 W 20140328; US 201414780134 A 20140328