EP 2980838 A4 20161116 - PROBE DEVICE
Title (en)
PROBE DEVICE
Title (de)
SONDENVORRICHTUNG
Title (fr)
DISPOSITIF DE SONDE
Publication
Application
Priority
- JP 2013067811 A 20130328
- JP 2014058150 W 20140318
Abstract (en)
[origin: EP2980838A1] A probe device includes an electrode plate arranged above a mounting table for mounting thereon a semiconductor wafer and electrically connected to a tester, a contact probe arranged at a side of the mounting table and electrically connected to a mounting table electrode of the mounting table. The contact probe includes a contact portion, having a top surface formed unenven, to be in contact with the electrode plate, and a cable connection portion formed as one unit with the contact portion. The contact portion and the cable connection portion are vertically movable by a biasing member provided below the cable connection portion. When the probes are made contact with electrodes of a semiconductor device of the semiconductor wafer by moving up the mounting table, the contact portion and the electrode plate are made contact with each other and the backside electrode and the tester are electrically connected to each other.
IPC 8 full level
G01R 31/28 (2006.01)
CPC (source: EP US)
G01R 1/07314 (2013.01 - US); G01R 31/26 (2013.01 - US); G01R 31/2887 (2013.01 - EP US); G01R 1/07342 (2013.01 - US); G01R 1/07378 (2013.01 - US); G01R 3/00 (2013.01 - US); G01R 31/2886 (2013.01 - US)
Citation (search report)
- [I] EP 2546668 A1 20130116 - TOKYO ELECTRON LTD [JP]
- [A] US 2004239355 A1 20041202 - KAZAMA TOSHIO [JP]
- [A] US 2004239356 A1 20041202 - KAZAMA TOSHIO [JP]
- [A] US 5667410 A 19970916 - JOHNSTON CHARLES J [US]
- [A] WO 2013018809 A1 20130207 - NHK SPRING CO LTD [JP], et al & US 2014247065 A1 20140904 - YAMADA YOSHIO [JP], et al
- See references of WO 2014157121A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2980838 A1 20160203; EP 2980838 A4 20161116; JP 2014192405 A 20141006; JP 6042761 B2 20161214; KR 101808395 B1 20180118; KR 20150135312 A 20151202; TW 201504633 A 20150201; TW I620939 B 20180411; US 2016061882 A1 20160303; US 9759762 B2 20170912; WO 2014157121 A1 20141002
DOCDB simple family (application)
EP 14774764 A 20140318; JP 2013067811 A 20130328; JP 2014058150 W 20140318; KR 20157026586 A 20140318; TW 103110463 A 20140320; US 201414781021 A 20140318