EP 2982726 A4 20160817 - ELECTRICALLY PEELABLE ADHESIVE COMPOSITION, ELECTRICALLY PEELABLE ADHESIVE SHEET, AND METHOD FOR USING ELECTRICALLY PEELABLE ADHESIVE SHEET
Title (en)
ELECTRICALLY PEELABLE ADHESIVE COMPOSITION, ELECTRICALLY PEELABLE ADHESIVE SHEET, AND METHOD FOR USING ELECTRICALLY PEELABLE ADHESIVE SHEET
Title (de)
ELEKTRISCH ABZIEHBARE HAFTZUSAMMENSETZUNG, ELEKTRISCH ABZIEHBARE KLEBEFOLIE UND VERFAHREN ZUR VERWENDUNG DER ELEKTRISCH ABZIEHBAREN KLEBEFOLIE
Title (fr)
COMPOSITION ADHÉSIVE PELABLE DE FAÇON ÉLECTRIQUE, FEUILLE ADHÉSIVE PELABLE DE FAÇON ÉLECTRIQUE ET PROCÉDÉ D'UTILISATION DE FEUILLE ADHÉSIVE PELABLE DE FAÇON ÉLECTRIQUE
Publication
Application
Priority
- JP 2013067219 A 20130327
- JP 2014058670 W 20140326
Abstract (en)
[origin: EP2982726A1] An electrically peelable pressure sensitive adhesive composition consists of an emulsion type acrylic pressure sensitive adhesive (A) comprising an acrylic polymer (A1) obtained by emulsion polymerization in the presence of a surfactant using a monomer mixture comprising an alkyl (meth)acrylate, and a (poly)alkylene polyol (B) having a number average molecular weight of 2000 or less, wherein a content of the component (B) based on 100 parts by mass of active ingredient of the component(A) is 3.5 parts by mass or more. In the electrically peelable pressure sensitive adhesive composition, the adhesiveness before voltage application is high, but the adhesiveness can decrease effectively by voltage application for a short time.
IPC 8 full level
C09J 133/06 (2006.01); B32B 27/00 (2006.01); C08F 2/24 (2006.01); C09J 7/00 (2006.01); C09J 7/02 (2006.01); C09J 9/00 (2006.01); C09J 171/02 (2006.01)
CPC (source: EP US)
B32B 7/06 (2013.01 - US); B32B 7/12 (2013.01 - EP US); B32B 27/08 (2013.01 - EP US); B32B 27/308 (2013.01 - EP US); C08F 2/24 (2013.01 - EP US); C08L 71/00 (2013.01 - EP US); C09J 5/00 (2013.01 - EP US); C09J 7/385 (2017.12 - EP US); C09J 9/00 (2013.01 - EP US); C09J 133/08 (2013.01 - EP US); C09J 133/10 (2013.01 - EP US); C09J 171/02 (2013.01 - EP US); B32B 2307/202 (2013.01 - EP US); B32B 2405/00 (2013.01 - US); B32B 2451/00 (2013.01 - US); C08F 220/1808 (2020.02 - EP US); C09J 2301/302 (2020.08 - US); C09J 2433/00 (2013.01 - US)
Citation (search report)
- [IY] EP 2562226 A1 20130227 - NITTO DENKO CORP [JP]
- [XY] EP 1595929 A1 20051116 - NITTO DENKO CORP [JP]
- [XY] DATABASE WPI Week 201015, Derwent World Patents Index; AN 2010-B81323, XP002759553
- See references of WO 2014157406A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2982726 A1 20160210; EP 2982726 A4 20160817; EP 2982726 B1 20190227; CN 105073938 A 20151118; CN 105073938 B 20171128; JP 6280915 B2 20180214; JP WO2014157406 A1 20170216; US 2016009960 A1 20160114; WO 2014157406 A1 20141002
DOCDB simple family (application)
EP 14773206 A 20140326; CN 201480017093 A 20140326; JP 2014058670 W 20140326; JP 2015508625 A 20140326; US 201414768300 A 20140326