EP 2985755 A1 20160217 - Electronic device having a part which is subject to temperature dependent deterioration
Title (en)
Electronic device having a part which is subject to temperature dependent deterioration
Title (de)
Elektronische Vorrichtung mit einem Teil mit temperatursabhängiger Verschlechterung
Title (fr)
Dispositif électronique ayant une partie qui est soumise à une détérioration dépendante de la température
Publication
Application
Priority
EP 14180481 A 20140811
Abstract (en)
An electronic device (1;100) comprises circuitry (7;101) and a part (5;102) with a deterioration which is dependent on a temperature behaviour of the part in a preceding period means. The device (1;100) further comprises means for deriving (12;103) an estimate of a thermal accumulated deterioration of the part (5;102) caused by the temperature behaviour in the preceding period. The device (1;100) is controlled in dependence on the estimate of the thermal accumulated deterioration, so as to cause that said part deteriorate in a defined manner. The invention is in particular suitable for thin LCD displays (2) in which the backlight is generated by LEDs (5). Due to the thin dimensions the temperature of the LEDs (5) and the solder joint with which the LEDs (5) are fixed to a circuit board in the backlight unit (3,4) can reach high levels which can cause substantial deterioration of the LEDS (5) and solder joints. In case the accumulated deterioration exceeds a reference level (Ref) belonging to the total time (Ttot) that the display device (1) is already in operation, then the average power to the LEDs (5) in the backlight units (3,4) is reduced. So it is achieved that the thermal accumulated damages is kept below the values belonging to the total operation time. In this way it is prevented that the lifespan of the display device (1) is reached too early.
IPC 8 full level
G09G 3/34 (2006.01); G09G 3/20 (2006.01); G09G 3/36 (2006.01)
CPC (source: EP)
G09G 3/3406 (2013.01); G09G 3/20 (2013.01); G09G 3/3611 (2013.01); G09G 2320/041 (2013.01); G09G 2320/048 (2013.01); G09G 2330/021 (2013.01)
Citation (applicant)
- US 6388388 B1 20020514 - WEINDORF PAUL FREDRICK LUTHER [US], et al
- SCHUBERT, A ET AL.: "Fatigue Life Models of SnAgCu and SnPb Solder Joints Evaluated by Experiments and Simulations", 53RD ECTC, 2003, pages 603 - 610
Citation (search report)
- [XYI] US 2010277410 A1 20101104 - YOU CHENHUA [US], et al
- [X] EP 2731094 A2 20140514 - YAZAKI CORP [JP]
- [X] EP 2081175 A2 20090722 - SAMSUNG MOBILE DISPLAY CO LTD [KR], et al
- [X] US 2013265293 A1 20131010 - KANZAKA KENJI [JP], et al
- [Y] ZAHN B A ED - INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS: "Solder joint fatigue life model methodology for 63Sn37Pb and 95.5Sn4Ag0.5Cu materials", 2003 PROCEEDINGS 53RD. ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE. (ECTC). NEW ORLEANS, LA, MAY 27 - 30, 2003; [PROCEEDINGS OF THE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE], NEW YORK, NY : IEEE, US, vol. CONF. 53, 27 May 2003 (2003-05-27), pages 83 - 94, XP010648371, ISBN: 978-0-7803-7991-6, DOI: 10.1109/ECTC.2003.1216261
- [A] ECKERT T ET AL: "A solder joint fatigue life model for combined vibration and temperature environments", ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, 2009. ECTC 2009. 59TH, IEEE, PISCATAWAY, NJ, USA, 26 May 2009 (2009-05-26), pages 522 - 528, XP031474966, ISBN: 978-1-4244-4475-5
- [YD] SCHUBERT, A ET AL.: "Fatigue Life Models of SnAgCu and SnPb Solder Joints Evaluated by Experiments and Simulations", 53RD ECTC, 2003, pages 603 - 610, XP002731923
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DOCDB simple family (application)
EP 14180481 A 20140811