EP 2987182 B1 20201118 - SEMICONDUCTOR PACKAGE HAVING IC DICE AND VOLTAGE TUNERS
Title (en)
SEMICONDUCTOR PACKAGE HAVING IC DICE AND VOLTAGE TUNERS
Title (de)
HALBLEITERGEHÄUSE MIT IC-CHIPS UND SPANNUNGSTUNERN
Title (fr)
BOÎTIER À SEMI-CONDUCTEURS AYANT UNE PUCE DE CIRCUIT IMPRIMÉ (IC) ET DES DISPOSITIFS D'ACCORD DE TENSION
Publication
Application
Priority
- US 201313866893 A 20130419
- US 2013073683 W 20131206
Abstract (en)
[origin: US2014312483A1] A semiconductor package includes an interposer and a plurality of integrated circuit (IC) dice disposed on and intercoupled via the interposer. A first IC die has a clock speed rating that is greater than a clock speed rating of another of the IC dice. A plurality of programmable voltage tuners are coupled to the plurality of IC dice, respectively. A first voltage tuner is coupled to the first IC die, and the first voltage tuner is programmed to reduce a voltage level of voltage input to the first voltage tuner and output the reduced voltage to the first IC die.
IPC 8 full level
H01L 25/065 (2006.01); G06F 1/32 (2019.01)
CPC (source: EP US)
G06F 1/3203 (2013.01 - US); G06F 1/324 (2013.01 - EP US); G06F 30/343 (2020.01 - US); H01L 25/0652 (2013.01 - US); H01L 25/0655 (2013.01 - EP US); G06F 30/30 (2020.01 - US); G06F 30/34 (2020.01 - US); H01L 2224/0401 (2013.01 - EP US); H01L 2224/0557 (2013.01 - EP US); H01L 2224/06181 (2013.01 - EP US); H01L 2224/14181 (2013.01 - EP US); H01L 2224/16145 (2013.01 - EP US); H01L 2224/16225 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2224/73257 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/15192 (2013.01 - EP US); H01L 2924/15311 (2013.01 - EP US); Y02D 10/00 (2017.12 - EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
US 2014312483 A1 20141023; US 9000490 B2 20150407; CN 105164805 A 20151216; CN 105164805 B 20181016; EP 2987182 A1 20160224; EP 2987182 B1 20201118; JP 2016518715 A 20160623; JP 6367312 B2 20180801; KR 102112896 B1 20200519; KR 20150144791 A 20151228; WO 2014171977 A1 20141023
DOCDB simple family (application)
US 201313866893 A 20130419; CN 201380075749 A 20131206; EP 13812361 A 20131206; JP 2016508930 A 20131206; KR 20157032998 A 20131206; US 2013073683 W 20131206