EP 2990845 A4 20160817 - HEAT DISSIPATION STRUCTURE OF OPTICAL MODULE, AND ELECTRONIC DEVICE
Title (en)
HEAT DISSIPATION STRUCTURE OF OPTICAL MODULE, AND ELECTRONIC DEVICE
Title (de)
WÄRMEABLEITUNGSSTRUKTUR EINES OPTISCHEN MODULS UND ELEKTRONISCHE VORRICHTUNG
Title (fr)
STRUCTURE DE DISSIPATION THERMIQUE DE MODULE OPTIQUE ET DISPOSITIF ÉLECTRONIQUE
Publication
Application
Priority
- CN 201310589282 A 20131120
- CN 2014074959 W 20140409
Abstract (en)
[origin: EP2990845A1] The present invention discloses an optical module heat dissipation structure, disposed inside an enclosure, where the optical module heat dissipation structure includes an optical module, an elastic component, a fixed wall, and a heat dissipation wall, where the fixed wall and the heat dissipation wall are both connected to the enclosure, the optical module is disposed between the fixed wall and the heat dissipation wall, the elastic component elastically abuts between the fixed wall and the optical module, and elasticity of the elastic component makes the optical module tightly cling to the heat dissipation wall, to improve the heat dissipation efficiency of the optical module heat dissipation structure. The present invention further discloses an electronic product, where the electronic product includes the optical module heat dissipation structure. An optical module of the optical module heat dissipation structure and the electronic product provided in the present invention tightly clings to a heat dissipation wall, which improves a heat dissipation effect of the optical module, to meet a heat dissipation requirement of the optical module, and increase the service life of the optical module.
IPC 8 full level
CPC (source: EP US)
G02B 6/4269 (2013.01 - US); G02B 6/4271 (2013.01 - US); G02B 6/4272 (2013.01 - EP US); H05K 7/2039 (2013.01 - US); H05K 7/2049 (2013.01 - EP US)
Citation (search report)
- [X] US 2012045181 A1 20120223 - ISHII KUNIYUKI [JP], et al
- [XI] US 2005238074 A1 20051027 - MATSUSHITA KOICHI [JP], et al
- [XI] US 2013176748 A1 20130711 - SHAW CHENG-DA [TW], et al
- [X] EP 0858106 A1 19980812 - NEC CORP [JP]
- [A] US 2008186681 A1 20080807 - DECK JOSEPH F [US], et al
- [A] WO 2012126748 A1 20120927 - BOSCH GMBH ROBERT [DE], et al
- [A] DE 10154878 A1 20030522 - MOTION GES FUER ANTRIEBSTECHNI [DE]
- See references of WO 2015074366A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 2990845 A1 20160302; EP 2990845 A4 20160817; EP 2990845 B1 20200506; CN 104661487 A 20150527; CN 104661487 B 20170620; US 2016109670 A1 20160421; US 9739960 B2 20170822; WO 2015074366 A1 20150528
DOCDB simple family (application)
EP 14864147 A 20140409; CN 201310589282 A 20131120; CN 2014074959 W 20140409; US 201514980458 A 20151228