EP 2996199 A1 20160316 - Connection assembly, method of manufacturing a connection assembly, and tool for manufacturing a connection assembly

Title (en)

Connection assembly, method of manufacturing a connection assembly, and tool for manufacturing a connection assembly

Title (de)

Verbindungsanordnung, Verfahren zur Herstellung einer Verbindungsanordnung und Werkzeug zur Herstellung einer Verbindungsanordnung

Title (fr)

Ensemble de connexion, procédé de fabrication d'un ensemble de connexion et outil de fabrication d'un ensemble de connexion

Publication

EP 2996199 A1 20160316 (EN)

Application

EP 14306426 A 20140915

Priority

EP 14306426 A 20140915

Abstract (en)

The invention relates to a connection assembly (1) comprising at least one conductor (2) and at least one connection device (3) which is plastically deformed about the conductor (2) to form two faces (7) which face each other. The invention further relates to a method of manufacturing such a connection assembly (1) and to a tool (10) for manufacturing such a connection assembly (1). The object of the invention is thus to provide a solution that allows to use such connection assemblies (1) in a wider size range and with different materials. This object is achieved by a connection assembly (1) in which the two faces (7) are connected to each other by a material bond (15). An inventive method includes the step of materially bonding the two adjacent faces (7) to each other. An inventive tool (10) comprises a bonding unit (14) for materially bonding the two faces (7) of the connection device (3) to each other.

IPC 8 full level

H01R 4/18 (2006.01); H01R 43/02 (2006.01); H01R 43/048 (2006.01); H01R 43/058 (2006.01)

CPC (source: EP)

H01R 4/187 (2013.01); H01R 43/0214 (2013.01); H01R 43/048 (2013.01); H01R 43/058 (2013.01); H01R 43/0221 (2013.01)

Citation (search report)

[XY] US 2014144016 A1 20140529 - BAUER HANS [DE], et al
[Y] US 5808260 A 19980915 - ASAKURA NOBUYUKI [JP], et al
[Y] WO 2011125348 A1 20111013 - SUMITOMO WIRING SYSTEMS [JP], et al
[X] WO 2014021336 A1 20140206 - YAZAKI CORP [JP]
[X] US 2004142607 A1 20040722 - ASAKURA NOBUYUKI [JP], et al
[X] DE 102012007846 A1 20131024 - AUDI AG [DE], et al

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

EP 2996199 A1 20160316; EP 2996199 B1 20190109

DOCDB simple family (application)

EP 14306426 A 20140915