EP 3002350 B1 20171122 - CYANIDE-FREE ELECTROPLATING BATHS FOR WHITE BRONZE BASED ON COPPER (I) IONS
Title (en)
CYANIDE-FREE ELECTROPLATING BATHS FOR WHITE BRONZE BASED ON COPPER (I) IONS
Title (de)
CYANIDFREIE GALVANISCHE BÄDER FÜR WEISSE BRONZE BASIEREND AUF KUPFER (I) IONEN
Title (fr)
BAINS D'ÉLECTRODÉPOSITION SANS CYANURE POUR BRONZE BLANC À BASE D'IONS CUIVRE (I)
Publication
Application
Priority
US 201414503389 A 20140930
Abstract (en)
[origin: EP3002350A1] Copper alloy electroplating baths include one or more sources of copper (I) ions and one or more sources of tin ions to electroplate copper/tin alloys of mirror bright white bronze. The copper alloys may also include one or more sources of silver ions to electroplate ternary alloys of bright white bronze containing copper/tin/silver. The copper alloy electroplating baths are cyanide-free.
IPC 8 full level
C25D 3/58 (2006.01); C25D 5/10 (2006.01); C25D 5/12 (2006.01)
CPC (source: EP US)
C25D 3/58 (2013.01 - EP US); C25D 5/10 (2013.01 - EP US); C25D 5/12 (2013.01 - EP US); C25D 5/627 (2020.08 - EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 3002350 A1 20160406; EP 3002350 B1 20171122; CN 105463528 A 20160406; CN 105463528 B 20171208; JP 2016074979 A 20160512; JP 6062010 B2 20170118; KR 101712960 B1 20170308; KR 20160038805 A 20160407; TW 201612363 A 20160401; TW I609102 B 20171221; US 2016298249 A1 20161013
DOCDB simple family (application)
EP 15185289 A 20150915; CN 201510624365 A 20150925; JP 2015187883 A 20150925; KR 20150136441 A 20150925; TW 104131420 A 20150923; US 201414503389 A 20140930