EP 3007211 A4 20161214 - ELECTRONIC MEMBER PEELING METHOD AND LAMINATED BODY
Title (en)
ELECTRONIC MEMBER PEELING METHOD AND LAMINATED BODY
Title (de)
ABLÖSEVERFAHREN FÜR ELEKTRONISCHES ELEMENT UND LAMINIERTER KÖRPER
Title (fr)
PROCÉDÉ DE DÉTACHEMENT D'UN ÉLÉMENT ÉLECTRONIQUE ET CORPS STRATIFIÉ
Publication
Application
Priority
- JP 2013115704 A 20130531
- JP 2014063578 W 20140522
Abstract (en)
[origin: EP3007211A1] Provided is a method of peeling an electronic member (16) from a laminate (10) composed of the electronic member (16) adhered to a supporting substrate (12) via an adhesive film (14), the adhesive film (14) having a self-peeling adhesive layer (17) on a surface located on the side of the supporting substrate (12) and an exposed region A in at least one part of a surface (14a) which is located on the side of the electronic member (16). The method includes: a step of reducing adhesive strength between the supporting substrate (12) and the self-peeling adhesive layer (17) in the region A by applying energy on the region A; a step of removing the supporting substrate (a) from the laminate by further applying energy on the region and thus further reducing the adhesive strength reduced in the prior step between the supporting substrate (a) and the self-peeling adhesive layer from a starting point of the interface between the supporting substrate (a) and the self-peeling adhesive layer; and a step of peeling the electronic member (16) from the laminate by removing the adhesive film (14) from the electronic member (16).
IPC 8 full level
H01L 21/304 (2006.01); C09J 5/00 (2006.01); H01L 21/683 (2006.01)
CPC (source: EP US)
B32B 43/006 (2013.01 - US); C09J 5/00 (2013.01 - EP US); H01L 21/6835 (2013.01 - EP US); C09J 2203/326 (2013.01 - EP US); C09J 2301/416 (2020.08 - EP US); C09J 2301/502 (2020.08 - EP US); H01L 2221/68318 (2013.01 - EP US); H01L 2221/68327 (2013.01 - EP US); H01L 2221/68381 (2013.01 - EP US); H01L 2221/68386 (2013.01 - EP US)
Citation (search report)
- [X] WO 2013063603 A2 20130502 - SUSS MICROTEC INC [US]
- [XA] US 2007243352 A1 20071018 - TAKAYAMA TORU [JP], et al
- See references of WO 2014192631A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 3007211 A1 20160413; EP 3007211 A4 20161214; CN 105264645 A 20160120; CN 105264645 B 20180501; JP 6118404 B2 20170419; JP WO2014192631 A1 20170223; KR 101772787 B1 20170829; KR 20150140801 A 20151216; SG 11201509300P A 20151230; TW 201444679 A 20141201; TW I626152 B 20180611; US 2016141197 A1 20160519; WO 2014192631 A1 20141204
DOCDB simple family (application)
EP 14803829 A 20140522; CN 201480028844 A 20140522; JP 2014063578 W 20140522; JP 2015519820 A 20140522; KR 20157032145 A 20140522; SG 11201509300P A 20140522; TW 103118655 A 20140528; US 201414891865 A 20140522