EP 3007231 B1 20201209 - SEMICONDUCTOR DEVICE
Title (en)
SEMICONDUCTOR DEVICE
Title (de)
HALBLEITERBAUELEMENT
Title (fr)
DISPOSITIF À SEMI-CONDUCTEUR
Publication
Application
Priority
- JP 2014005880 A 20140116
- JP 2014078711 W 20141029
Abstract (en)
[origin: EP3007231A1] A gate pad electrode and a source electrode are disposed, separately from one another, on the front surface of a super junction semiconductor substrate. AMOS gate structure formed of n source regions, p channel regions, p contact regions, a gate oxide film, and polysilicon gate electrodes is formed immediately below the source electrode. p well regions are formed immediately below the gate pad electrode. The p channel regions are linked to the p well regions via extension portions. By making the width of the p well regions wider than the width of the p channel regions, it is possible to reduce a voltage drop caused by a reverse recovery current generated in a reverse recovery process of a body diode. Therefore, it is possible to prevent breakdown of a portion of a gate insulating film immediately below the center of the gate pad electrode, and thus prevent breakdown of a semiconductor device.
IPC 8 full level
H01L 29/78 (2006.01); H01L 29/06 (2006.01); H01L 29/423 (2006.01)
CPC (source: EP US)
H01L 29/0634 (2013.01 - EP US); H01L 29/0649 (2013.01 - US); H01L 29/0696 (2013.01 - EP US); H01L 29/0865 (2013.01 - EP US); H01L 29/0882 (2013.01 - US); H01L 29/1037 (2013.01 - US); H01L 29/1095 (2013.01 - EP US); H01L 29/42356 (2013.01 - US); H01L 29/42372 (2013.01 - EP US); H01L 29/78 (2013.01 - US); H01L 29/7802 (2013.01 - EP US); H01L 29/7395 (2013.01 - EP US); H01L 29/7805 (2013.01 - EP US); H01L 29/7811 (2013.01 - EP US); H01L 2224/0603 (2013.01 - EP)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 3007231 A1 20160413; EP 3007231 A4 20170215; EP 3007231 B1 20201209; CN 105378932 A 20160302; CN 105378932 B 20171031; JP 6146486 B2 20170614; JP WO2015107742 A1 20170323; TW 201539710 A 20151016; TW I626729 B 20180611; US 2016126314 A1 20160505; US 9620595 B2 20170411; WO 2015107742 A1 20150723
DOCDB simple family (application)
EP 14878460 A 20141029; CN 201480038545 A 20141029; JP 2014078711 W 20141029; JP 2015557710 A 20141029; TW 104100715 A 20150109; US 201614991877 A 20160108