Global Patent Index - EP 3023520 B1

EP 3023520 B1 20190130 - ENVIRONMENTALLY FRIENDLY GOLD ELECTROPLATING COMPOSITIONS AND CORRESPONDING METHOD

Title (en)

ENVIRONMENTALLY FRIENDLY GOLD ELECTROPLATING COMPOSITIONS AND CORRESPONDING METHOD

Title (de)

UMWELTFREUNDLICHES GOLD GALVANISCHES BAD UND ENTSPRECHENDES VERFAHREN

Title (fr)

COMPOSITIONS D'ÉLECTRODÉPOSITION D'OR ÉCOLOGIQUE ET PROCÉDÉ CORRESPONDANT

Publication

EP 3023520 B1 20190130 (EN)

Application

EP 15193859 A 20151110

Priority

US 201414549571 A 20141121

Abstract (en)

[origin: EP3023520A1] Gold electroplating compositions are substantially free of many environmental toxins to provide an environmentally friendly pure gold electroplating composition. The substantially pure gold electroplating compositions may electroplate gold over a broad current density range to deposit bright to matte gold layers on various types of electronic components and decorative articles.

IPC 8 full level

C25D 5/18 (2006.01); C25D 3/48 (2006.01); C25D 3/62 (2006.01); C25D 7/00 (2006.01)

CPC (source: EP US)

C25D 3/48 (2013.01 - EP US); C25D 3/62 (2013.01 - EP US); C25D 5/18 (2013.01 - EP US); C25D 5/605 (2020.08 - EP US); C25D 5/611 (2020.08 - EP US); C25D 5/617 (2020.08 - EP US); C25D 5/623 (2020.08 - EP US); C25D 5/627 (2020.08 - EP US); C25D 7/00 (2013.01 - EP US); C25D 7/005 (2013.01 - EP US)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

EP 3023520 A1 20160525; EP 3023520 B1 20190130; CN 105624745 A 20160601; CN 105624745 B 20181106; JP 2016117946 A 20160630; JP 6073450 B2 20170201; KR 101712970 B1 20170308; KR 20160061268 A 20160531; TW 201619446 A 20160601; TW I600805 B 20171001; US 2016145756 A1 20160526

DOCDB simple family (application)

EP 15193859 A 20151110; CN 201510809862 A 20151120; JP 2015224497 A 20151117; KR 20150162243 A 20151119; TW 104137385 A 20151112; US 201414549571 A 20141121