EP 3026143 A1 20160601 - Plating bath and method for electroless deposition of nickel layers
Title (en)
Plating bath and method for electroless deposition of nickel layers
Title (de)
Plattierbad und Verfahren zur stromlosen Abscheidung von Nickelschichten
Title (fr)
Bain de placage et procédé de dépôt anélectrolytique de couches de nickel
Publication
Application
Priority
EP 14194890 A 20141126
Abstract (en)
The present invention relates to aqueous plating bath compositions and methods for deposition of nickel and nickel alloys utilizing mixtures of stabilizing agents comprising metal ions of at least one of indium and gallium and iodine containing, inorganic compounds in order to enhance bath stability.
IPC 8 full level
C23C 18/32 (2006.01); C23C 18/50 (2006.01)
CPC (source: CN EP KR US)
C23C 18/1646 (2013.01 - US); C23C 18/36 (2013.01 - CN EP KR US); C23C 18/50 (2013.01 - CN EP KR US)
Citation (applicant)
- US 2658841 A 19531110 - GREGOIRE GUTZEIT, et al
- US 2658842 A 19531110 - GREGOIRE GUTZEIT, et al
- US 2762723 A 19560911 - PAUL TALMEY, et al
- JP 2005194562 A 20050721 - MURATA MANUFACTURING CO
- US 4189324 A 19800219 - GULLA MICHAEL [US], et al
- US 2935425 A 19600503 - GREGOIRE GUTZEIT, et al
- US 3338726 A 19670829 - TALIVALDIS BERZINS
- US 3597266 A 19710803 - LEIBOWITZ GARY, et al
- US 3915716 A 19751028 - HAACK WOLF-DIETER
- US 4780342 A 19881025 - LEBLANC JR OLIVER H [US]
- US 3953654 A 19760427 - FELDSTEIN NATHAN
- WO 2010045559 A1 20100422 - ATOTECH DEUTSCHLAND GMBH [DE], et al
Citation (search report)
- [A] EP 2194156 A1 20100609 - UYEMURA C & CO LTD [JP]
- [AD] US 4189324 A 19800219 - GULLA MICHAEL [US], et al
- [AD] JP 2005194562 A 20050721 - MURATA MANUFACTURING CO
- [A] EP 2671969 A1 20131211 - ATOTECH DEUTSCHLAND GMBH [DE]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3026143 A1 20160601; CA 2968437 A1 20160602; CA 2968437 C 20221122; CN 107109654 A 20170829; CN 107109654 B 20190827; EP 3224388 A1 20171004; EP 3224388 B1 20181017; ES 2705430 T3 20190325; JP 2017535674 A 20171130; JP 6667525 B2 20200318; KR 102497590 B1 20230207; KR 20170086051 A 20170725; MY 186470 A 20210722; TW 201623686 A 20160701; TW I683927 B 20200201; US 2017335462 A1 20171123; WO 2016083195 A1 20160602
DOCDB simple family (application)
EP 14194890 A 20141126; CA 2968437 A 20151117; CN 201580058168 A 20151117; EP 15797992 A 20151117; EP 2015076822 W 20151117; ES 15797992 T 20151117; JP 2017528538 A 20151117; KR 20177014492 A 20151117; MY PI2017701361 A 20151117; TW 104139483 A 20151126; US 201515520558 A 20151117