EP 3026764 A1 20160601 - METHOD FOR FABRICATION OF ANISOTROPIC CONDUCTIVE MEMBER AND METHOD FOR FABRICATION OF ANISOTROPIC CONDUCTIVE BONDING PACKAGE
Title (en)
METHOD FOR FABRICATION OF ANISOTROPIC CONDUCTIVE MEMBER AND METHOD FOR FABRICATION OF ANISOTROPIC CONDUCTIVE BONDING PACKAGE
Title (de)
VERFAHREN ZUR HERSTELLUNG EINES ANISOTROPEN LEITFÄHIGEN ELEMENTS UND VERFAHREN ZUR HERSTELLUNG EINER ANISOTROPEN LEITFÄHIGEN BONDINGVERKAPSELUNG
Title (fr)
PROCÉDÉ DE FABRICATION D'ÉLÉMENT CONDUCTEUR ANISOTROPE ET PROCÉDÉ DE FABRICATION DE BOÎTIER DE COLLAGE CONDUCTEUR ANISOTROPE
Publication
Application
Priority
- JP 2013151603 A 20130722
- JP 2014069239 W 20140718
Abstract (en)
Provided is a method for fabrication of an anisotropic conductive member, the method including a residual stress relaxation step of obtaining an anisotropic conductive member that has been subjected to a treatment for relaxing residual stress, after fabricating an anisotropic conductive member having plural conductive paths, in which plural micropores of an insulating matrix formed from an anodic oxide film are filled with a conductive member.
IPC 8 full level
H01R 43/00 (2006.01); C25D 1/00 (2006.01); C25D 5/50 (2006.01); C25D 11/04 (2006.01); C25D 11/18 (2006.01); C25D 11/20 (2006.01); C25D 11/24 (2006.01); H01B 5/16 (2006.01); H01B 13/00 (2006.01); H01R 11/01 (2006.01); C23C 18/16 (2006.01); C25D 3/38 (2006.01); C25D 11/10 (2006.01); C25D 11/16 (2006.01)
CPC (source: EP US)
C25D 1/006 (2013.01 - EP US); C25D 5/50 (2013.01 - EP US); C25D 11/045 (2013.01 - EP US); C25D 11/18 (2013.01 - EP US); C25D 11/20 (2013.01 - EP US); C25D 11/24 (2013.01 - EP US); C23C 18/1603 (2013.01 - EP US); C23C 18/1653 (2013.01 - EP US); C25D 3/38 (2013.01 - EP US); C25D 11/10 (2013.01 - EP US); C25D 11/16 (2013.01 - EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3026764 A1 20160601; EP 3026764 A4 20161116; CN 105431987 A 20160323; JP 2017022126 A 20170126; JP 6030241 B2 20161124; JP 6166826 B2 20170719; JP WO2015012234 A1 20170302; KR 101795538 B1 20171108; KR 20160023844 A 20160303; US 2016138180 A1 20160519; WO 2015012234 A1 20150129
DOCDB simple family (application)
EP 14830337 A 20140718; CN 201480041699 A 20140718; JP 2014069239 W 20140718; JP 2015528275 A 20140718; JP 2016170735 A 20160901; KR 20167001900 A 20140718; US 201615003154 A 20160121