EP 3027363 B1 20200115 - LOW DENSITY POLISHING PAD
Title (en)
LOW DENSITY POLISHING PAD
Title (de)
POLIERKISSEN MIT NIEDRIGER DICHTE
Title (fr)
TAMPON DE POLISSAGE À FAIBLE DENSITÉ
Publication
Application
Priority
- US 201313955398 A 20130731
- US 2014047065 W 20140717
Abstract (en)
[origin: US2015038066A1] Low density polishing pads and methods of fabricating low density polishing pads are described. In an example, a polishing pad for polishing a substrate includes a polishing body having a density of less than 0.5 g/cc and composed of a thermoset polyurethane material. A plurality of closed cell pores is dispersed in the thermoset polyurethane material.
IPC 8 full level
B24B 37/24 (2012.01)
CPC (source: EP US)
B24B 37/205 (2013.01 - US); B24B 37/24 (2013.01 - EP US); B24D 11/006 (2013.01 - US); B24D 11/04 (2013.01 - US)
Citation (examination)
US 5885312 A 19990323 - FRUITMAN CLINTON O [US]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
US 2015038066 A1 20150205; CN 105408063 A 20160316; CN 105408063 B 20180130; EP 3027363 A1 20160608; EP 3027363 B1 20200115; JP 2016525459 A 20160825; JP 2017042910 A 20170302; JP 2019077036 A 20190523; JP 6415521 B2 20181031; JP 6517802 B2 20190522; KR 101801693 B1 20171127; KR 20160027075 A 20160309; SG 11201600242P A 20160226; TW 201509595 A 20150316; TW I579106 B 20170421; WO 2015017138 A1 20150205
DOCDB simple family (application)
US 201313955398 A 20130731; CN 201480042621 A 20140717; EP 14747270 A 20140717; JP 2016234679 A 20161202; JP 2016531739 A 20140717; JP 2018238139 A 20181220; KR 20167002464 A 20140717; SG 11201600242P A 20140717; TW 103126073 A 20140730; US 2014047065 W 20140717