EP 3028126 A4 20170125 - BONDING ELECTRONIC COMPONENTS TO PATTERNED NANOWIRE TRANSPARENT CONDUCTORS
Title (en)
BONDING ELECTRONIC COMPONENTS TO PATTERNED NANOWIRE TRANSPARENT CONDUCTORS
Title (de)
VERBINDUNG ELEKTRONISCHER BAUTEILE MIT STRUKTURIERTEN TRANSPARENTEN NANODRAHTLEITERN
Title (fr)
FIXATION DE COMPOSANTS ÉLECTRONIQUES À DES CONDUCTEURS IMPRIMÉS TRANSPARENTS À BASE DE NANOFILS
Publication
Application
Priority
- US 201361860841 P 20130731
- US 2014047212 W 20140718
Abstract (en)
[origin: WO2015017143A1] A method for making an electronic assembly includes applying a conductive adhesive to a resist layer overlying a patterned conductive nanowire layer on a substrate and engaging an electrical contact of an electronic component with the conductive adhesive to provide an electrical connection between the electronic component and the conductive nanowire layer.
IPC 8 full level
G06F 3/041 (2006.01); H01B 13/00 (2006.01)
CPC (source: EP US)
G06F 3/041 (2013.01 - EP US); G06F 3/0412 (2013.01 - US); G06F 3/047 (2013.01 - US); H05K 1/028 (2013.01 - US); H05K 1/0296 (2013.01 - US); H05K 1/09 (2013.01 - US); H05K 1/097 (2013.01 - EP US); H05K 3/048 (2013.01 - EP US); H05K 3/103 (2013.01 - US); H05K 3/284 (2013.01 - US); H05K 3/323 (2013.01 - EP US); G06F 2203/04103 (2013.01 - EP US); G06F 2203/04112 (2013.01 - EP US); H05K 1/0393 (2013.01 - EP US); H05K 2201/026 (2013.01 - EP US); H05K 2201/10128 (2013.01 - EP US); H05K 2203/0143 (2013.01 - EP US); H05K 2203/1469 (2013.01 - US); H05K 2203/1545 (2013.01 - EP US)
Citation (search report)
- [Y] US 2011155430 A1 20110630 - LEE GYU HO [KR], et al
- [Y] WO 2012145157 A1 20121026 - 3M INNOVATIVE PROPERTIES CO [US], et al
- [A] JP 2013077435 A 20130425 - OJI HOLDINGS CORP
- See references of WO 2015017143A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2015017143 A1 20150205; BR 112016002093 A2 20170801; CN 105453001 A 20160330; CN 105453001 B 20181016; EP 3028126 A1 20160608; EP 3028126 A4 20170125; EP 3028126 B1 20201007; JP 2016530622 A 20160929; JP 6426737 B2 20181121; KR 102254683 B1 20210521; KR 20160036571 A 20160404; SG 10201808518R A 20181030; SG 11201600591V A 20160226; US 2016143153 A1 20160519; US 9980394 B2 20180522
DOCDB simple family (application)
US 2014047212 W 20140718; BR 112016002093 A 20140718; CN 201480042647 A 20140718; EP 14832317 A 20140718; JP 2016531742 A 20140718; KR 20167003895 A 20140718; SG 10201808518R A 20140718; SG 11201600591V A 20140718; US 201414897521 A 20140718