EP 3028551 B1 20170614 - ELECTRONIC MODULE HAVING CIRCUIT BOARDS AND A PLASTIC SEALING RING THAT CAN BE MOLDED ON BY INJECTION MOLDING, IN PARTICULAR FOR A MOTOR VEHICLE TRANSMISSION CONTROL UNIT, AND METHOD FOR PRODUCING SAID ELECTRONIC MODULE
Title (en)
ELECTRONIC MODULE HAVING CIRCUIT BOARDS AND A PLASTIC SEALING RING THAT CAN BE MOLDED ON BY INJECTION MOLDING, IN PARTICULAR FOR A MOTOR VEHICLE TRANSMISSION CONTROL UNIT, AND METHOD FOR PRODUCING SAID ELECTRONIC MODULE
Title (de)
ELEKTRONIKMODUL MIT LEITERPLATTEN UND ANSPRITZBAREM KUNSTSTOFF-DICHTRING, INSBESONDERE FÜR EIN KFZ-GETRIEBESTEUERGERÄT, UND VERFAHREN ZUM FERTIGEN DESSELBEN
Title (fr)
MODULE ÉLECTRONIQUE AVEC CIRCUITS IMPRIMÉS ET BAGUE D'ÉTANCHÉITÉ EN MATIÈRE PLASTIQUE PULVÉRISABLE, NOTAMMENT POUR UN CONTRÔLEUR DE BOÎTE DE VITESSES DE VÉHICULE AUTOMOBILE, ET PROCÉDÉ POUR SA FABRICATION
Publication
Application
Priority
- DE 102013215246 A 20130802
- EP 2014065872 W 20140724
Abstract (en)
[origin: WO2015014697A1] The invention relates to an electronic module (1), in particular for a motor vehicle transmission controller, and to a method for producing said electronic module. The electronic module (1) has a first circuit board element (3), a second circuit board element (5), and a spacer (7). Together, the first circuit board element, the second circuit board element, and the spacer enclose a central cavity (9), in which components (25) attached to the first circuit board element (3) are accommodated. Respective annular circumferential microstructures (17, 21) produced, for example, by means of laser texturing are provided on a surface (13) of the first circuit board element (3) directed outward and on a surface (19) of the second circuit board element (5) directed outward, adjacent to an outer periphery (15) of the first circuit board element (3). In this region, a sealing ring (25) is formed, which has a form-closed connection to both the first and the second circuit board element (3, 5) by means of the microstructures (17, 21) of the first and the second circuit board element. The sealing ring (25) can be made of a resistant plastic, which is molded on by injection molding in the liquid state in the region of the outer periphery (15) of the first circuit board element (3) and flows into recesses of the microstructures (17, 21) and, after the curing, forms the form-closed and sealing connection between the two circuit board elements (3, 5) and the sealing ring (25) thereby formed.
IPC 8 full level
H05K 5/00 (2006.01); B29C 45/14 (2006.01); H05K 1/14 (2006.01); H05K 3/28 (2006.01); H05K 5/06 (2006.01)
CPC (source: EP US)
B29C 39/10 (2013.01 - EP US); B29C 45/14311 (2013.01 - EP US); B29C 45/14467 (2013.01 - EP US); B29C 65/542 (2013.01 - EP US); H05K 1/141 (2013.01 - EP US); H05K 1/144 (2013.01 - US); H05K 1/18 (2013.01 - US); H05K 3/0044 (2013.01 - US); H05K 3/368 (2013.01 - US); H05K 5/0043 (2013.01 - US); H05K 5/0082 (2013.01 - EP US); H05K 5/065 (2013.01 - US); B29C 45/14508 (2013.01 - EP US); B29C 65/70 (2013.01 - EP US); B29C 66/02245 (2013.01 - EP US); B29C 66/0246 (2013.01 - EP US); B29C 66/112 (2013.01 - EP US); B29C 66/114 (2013.01 - EP US); B29C 66/30322 (2013.01 - EP US); B29C 66/53462 (2013.01 - EP US); B29C 66/71 (2013.01 - EP US); B29C 66/73161 (2013.01 - EP US); B29C 66/7394 (2013.01 - EP US); B29C 66/73941 (2013.01 - EP US); B29L 2031/3425 (2013.01 - EP US); B29L 2031/3481 (2013.01 - EP US); B29L 2031/7172 (2013.01 - EP US); H05K 3/284 (2013.01 - EP US); H05K 2201/042 (2013.01 - EP US); H05K 2201/09063 (2013.01 - EP US); H05K 2201/10295 (2013.01 - EP US); H05K 2201/1059 (2013.01 - EP US); H05K 2201/2018 (2013.01 - EP US); H05K 2201/2036 (2013.01 - US); H05K 2201/2072 (2013.01 - EP US); H05K 2203/1147 (2013.01 - EP US); H05K 2203/1327 (2013.01 - EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2015014697 A1 20150205; CN 105493642 A 20160413; CN 105493642 B 20190308; DE 102013215246 A1 20150205; EP 3028551 A1 20160608; EP 3028551 B1 20170614; US 10721819 B2 20200721; US 2016165727 A1 20160609
DOCDB simple family (application)
EP 2014065872 W 20140724; CN 201480043495 A 20140724; DE 102013215246 A 20130802; EP 14742221 A 20140724; US 201414908070 A 20140724