Global Patent Index - EP 3031551 A1

EP 3031551 A1 20160615 - COMPOSITE COPPER PARTICLES AND PRODUCTION METHOD THEREFOR

Title (en)

COMPOSITE COPPER PARTICLES AND PRODUCTION METHOD THEREFOR

Title (de)

VERBUNDKUPFERPARTIKEL UND HERSTELLUNGSVERFAHREN DAFÜR

Title (fr)

PARTICULES DE CUIVRE COMPOSITES ET PROCÉDÉ DE PRODUCTION DE CELLES-CI

Publication

EP 3031551 A1 20160615 (EN)

Application

EP 14834408 A 20140801

Priority

  • JP 2013164445 A 20130807
  • JP 2014070346 W 20140801

Abstract (en)

The composite copper particle of the invention is a composite copper particle including a flake-like copper particle and a plurality of inorganic oxide particles which are finer than the flake-like copper particle. The inorganic oxide particles are unevenly distributed on a surface of the flake-like copper particle. The composite copper particle preferably has a volume cumulative particle diameter D 50 at a cumulative volume of 50 vol% as measured by a laser diffraction scattering method of 0.1 µm to 10 µm. An aspect ratio of the maximum diameter d of a plane of the composite copper particle to the maximum thickness t of the composite copper particle, d/t, is preferably 5 to 30. The inorganic oxide particles preferably have a higher hardness than copper.

IPC 8 full level

B22F 1/068 (2022.01); B22F 1/16 (2022.01); C22C 9/00 (2006.01); C22C 9/01 (2006.01); C22C 9/10 (2006.01); H01B 1/00 (2006.01); H01B 1/22 (2006.01); H01B 5/00 (2006.01); H01B 13/00 (2006.01)

CPC (source: EP US)

B22F 1/068 (2022.01 - EP US); B22F 1/16 (2022.01 - EP US); C22C 9/01 (2013.01 - EP); H01B 1/16 (2013.01 - EP); H01B 1/22 (2013.01 - EP US); C22C 9/00 (2013.01 - EP)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

EP 3031551 A1 20160615; EP 3031551 A4 20170426; CN 105451914 A 20160330; JP 2015034309 A 20150219; KR 20160040538 A 20160414; TW 201511035 A 20150316; TW I556257 B 20161101; WO 2015019959 A1 20150212

DOCDB simple family (application)

EP 14834408 A 20140801; CN 201480043903 A 20140801; JP 2013164445 A 20130807; JP 2014070346 W 20140801; KR 20167002471 A 20140801; TW 103126967 A 20140806