EP 3036486 B1 20191016 - EFFICIENT TEMPERATURE FORCING OF SEMICONDUCTOR DEVICES UNDER TEST
Title (en)
EFFICIENT TEMPERATURE FORCING OF SEMICONDUCTOR DEVICES UNDER TEST
Title (de)
EFFIZIENTER TEMPERATURSCHOCK BEI HALBLEITERBAUELEMENTEN UNTER PRÜFUNG
Title (fr)
CONDITIONNEMENT EN TEMPÉRATURE DE DISPOSITIFS SEMI-CONDUCTEURS SOUS TESTS
Publication
Application
Priority
IL 2013050714 W 20130822
Abstract (en)
[origin: WO2015025307A1] A temperature-forcing system and method for controlling the temperature of an electronic device under test comprises a temperature-forcing head, including a face positionable in thermal contact with the device, and an evaporator, in direct or indirect thermal contact with the face; and a refrigerant circulation subsystem, including a compressor, a condenser, a flow control device for inducing a pressure drop in the refrigerant, and a conduit circuit through which the refrigerant is flowable. The subsystem cooperates with the evaporator so as to define at least one closed loop through which a corresponding bi-phase refrigerant is circulatable, so that, during circulation, the refrigerant is maintained in a liquid phase between the compressor and the flow control device and in a gaseous phase while flowing through the evaporator, The temperature of the device is therefore switchable by the head at a rapid rate of 50 to 150 degrees Celsius per minute.
IPC 8 full level
F25B 41/04 (2006.01); F25B 29/00 (2006.01); G05D 23/19 (2006.01); G05D 23/20 (2006.01)
CPC (source: EP IL)
G05D 23/1919 (2013.01 - EP IL)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2015025307 A1 20150226; EP 3036486 A1 20160629; EP 3036486 A4 20170322; EP 3036486 B1 20191016; IL 242485 B 20201029
DOCDB simple family (application)
IL 2013050714 W 20130822; EP 13892039 A 20130822; IL 24248515 A 20151105