Global Patent Index - EP 3036805 A1

EP 3036805 A1 20160629 - LASER COMPONENT AND METHOD FOR PRODUCING A LASER COMPONENT

Title (en)

LASER COMPONENT AND METHOD FOR PRODUCING A LASER COMPONENT

Title (de)

LASERBAUELEMENT UND VERFAHREN ZUM HERSTELLEN EINES LASERBAUELEMENTS

Title (fr)

COMPOSANT LASER ET PROCÉDÉ DE FABRICATION D'UN COMPOSANT LASER

Publication

EP 3036805 A1 20160629 (DE)

Application

EP 14750753 A 20140814

Priority

  • DE 102013216527 A 20130821
  • EP 2014067441 W 20140814

Abstract (en)

[origin: WO2015024864A1] The invention relates to a laser component (500) comprising an edge-emitting first laser chip (100). Said edge-emitting first laser chip has a top side (101), a bottom side (102), an end face (103), and a lateral surface (104, 105). An emission region (131) is formed on the end face. The lateral surface is oriented perpendicularly to the top side and to the end face. A first metallization (170) is arranged on the top side. A step is formed on the lateral surface, by means of which step a part of the lateral surface adjacent to the top side is recessed. A passivation layer (160) is arranged in the recessed part of the lateral surface. The laser chip is arranged on a carrier (400), which is composed of diamond, for example. The lateral surface (104) of the first laser chip (100) faces a surface of the carrier (400). A first solder contact (410) arranged on the surface of the carrier is connected to the first metallization (170) in an electrically conductive manner. By means of the electrical connection of the first metallization (170) of the first laser chip (100) to the first metallization of the third laser chip (300) and by means of SMD mounting by means of solder contacts (410, 420, 430), a laser component having high power, improved cooling, and no disturbing interferences can be provided, because the two emission regions (131) are located only at most 20 μm from each other (501).

IPC 8 full level

H01S 5/02375 (2021.01); H01S 5/024 (2006.01); H01S 5/042 (2006.01); H01S 5/22 (2006.01); H01S 5/40 (2006.01)

CPC (source: EP US)

H01S 5/02345 (2021.01 - EP US); H01S 5/0237 (2021.01 - EP US); H01S 5/02375 (2021.01 - EP US); H01S 5/0282 (2013.01 - US); H01S 5/04254 (2019.07 - EP US); H01S 5/22 (2013.01 - EP US); H01S 5/02355 (2021.01 - EP US); H01S 5/02469 (2013.01 - EP US); H01S 5/02484 (2013.01 - EP US); H01S 5/4043 (2013.01 - EP US); H01S 2301/176 (2013.01 - EP US)

Citation (search report)

See references of WO 2015024864A1

Citation (examination)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

WO 2015024864 A1 20150226; CN 105453350 A 20160330; CN 105453350 B 20211015; DE 102013216527 A1 20150226; EP 3036805 A1 20160629; US 10686295 B2 20200616; US 2016204573 A1 20160714

DOCDB simple family (application)

EP 2014067441 W 20140814; CN 201480046192 A 20140814; DE 102013216527 A 20130821; EP 14750753 A 20140814; US 201414912210 A 20140814