EP 3039368 A4 20170524 - KINETIC HEAT-SINK WITH INTERDIGITATED HEAT-TRANSFER FINS
Title (en)
KINETIC HEAT-SINK WITH INTERDIGITATED HEAT-TRANSFER FINS
Title (de)
KINETISCHER KÜHLKÖRPER MIT VERSCHACHTELTEN WÄRMEÜBERTRAGENDEN RIPPEN
Title (fr)
DISSIPATEUR THERMIQUE CINÉTIQUE COMPORTANT DES AILETTES DE TRANSFERT THERMIQUE INTERDIGITÉES
Publication
Application
Priority
- US 201361868362 P 20130821
- US 2014051987 W 20140821
Abstract (en)
[origin: WO2015027004A1] A kinetic heat sink has a stationary portion with a first heat-conducting surface and a second heat-conducting surface to conduct heat therebetween. To cool heat generating devices devices, the stationary portion is mountable to a heat-generating component and has a first plurality of fins extending therefrom. The kinetic heat sink also has a rotating structure rotatably coupled with the stationary portion. The rotating structure is configured to transfer heat received from the second heat-conducting surface to a thermal reservoir in thermal communication with the rotating structure. The rotating structure has a movable heat-extraction surface with a second plurality of fins extending toward the first plurality of fins. At least a portion of the first plurality of fins preferably are interdigitated with at least a portion of the second plurality of fins.
IPC 8 full level
F28D 11/02 (2006.01); F28F 3/02 (2006.01); F28F 5/00 (2006.01); G06F 1/20 (2006.01); H05K 7/20 (2006.01)
CPC (source: EP US)
F28F 5/04 (2013.01 - US); F28F 13/12 (2013.01 - US); F28F 13/14 (2013.01 - US); G06F 1/20 (2013.01 - EP US); H01L 23/367 (2013.01 - EP US); H01L 23/3672 (2013.01 - US); H01L 23/3675 (2013.01 - US); H01L 23/3736 (2013.01 - US); H01L 23/467 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US)
Citation (search report)
- [XPA] WO 2013184931 A1 20131212 - COOLCHIP TECHNOLOGIES INC [US]
- [XI] US 2008158819 A1 20080703 - KHANNA VIJAYESHWAR DAS [US], et al
- [XA] US 2003048013 A1 20030313 - LOPATINSKY EDWARD L [US], et al
- [A] US 2008159853 A1 20080703 - KHANNA VIJAYESHWAR D [US], et al
- See references of WO 2015027004A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2015027004 A1 20150226; CN 105849495 A 20160810; EP 3039368 A1 20160706; EP 3039368 A4 20170524; JP 2016528743 A 20160915; US 2016178289 A1 20160623
DOCDB simple family (application)
US 2014051987 W 20140821; CN 201480057452 A 20140821; EP 14838545 A 20140821; JP 2016536430 A 20140821; US 201414910430 A 20140821