Global Patent Index - EP 3044558 A1

EP 3044558 A1 20160720 - MEDIA ISOLATED PRESSURE SENSOR

Title (en)

MEDIA ISOLATED PRESSURE SENSOR

Title (de)

MEDIENISOLIERTER DRUCKSENSOR

Title (fr)

CAPTEUR DE PRESSION ISOLÉ D'UN MILIEU

Publication

EP 3044558 A1 20160720 (EN)

Application

EP 14761522 A 20140826

Priority

  • US 201314024919 A 20130912
  • US 2014052604 W 20140826

Abstract (en)

[origin: US2015068315A1] A pressure sensor includes a pressure sensing element and a top cap. The pressure sensing element includes a bonded wafer substrate having a buried sealed cavity. A wall of the buried sealed cavity forms a sensing diaphragm. One or more sense elements may be supported by the sensing diaphragm and one or more bond pads are supported by the upper side of the bonded wafer substrate. Each of the bond pads may be positioned adjacent to the sensing diaphragm and electrically connected to one or more of the sense elements. The top cap may be secured to the upper side of the bonded wafer substrate such that an aperture in the top cap facilitates passage of a media in a downward direction to the sensing diaphragm. The top cap may be configured to isolate the bond pads from the media.

IPC 8 full level

G01L 19/00 (2006.01); G01L 19/04 (2006.01)

CPC (source: EP US)

G01L 9/0052 (2013.01 - US); G01L 19/0007 (2013.01 - EP US); G01L 19/0038 (2013.01 - EP US); G01L 19/0061 (2013.01 - EP US); G01L 19/147 (2013.01 - EP US); H05K 3/30 (2013.01 - US); G01L 9/0055 (2013.01 - US); G01L 9/0092 (2013.01 - US); G01L 19/0084 (2013.01 - US); G01L 19/0627 (2013.01 - US); G01L 19/0645 (2013.01 - US); G01L 19/148 (2013.01 - US); H01L 2224/48137 (2013.01 - US); H01L 2224/73265 (2013.01 - US); Y10T 29/4913 (2015.01 - EP US); Y10T 29/49155 (2015.01 - EP US)

Citation (search report)

See references of WO 2015038320A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

US 2015068315 A1 20150312; US 9470593 B2 20161018; CN 205843877 U 20161228; EP 3044558 A1 20160720; JP 3207123 U 20161027; WO 2015038320 A1 20150319

DOCDB simple family (application)

US 201314024919 A 20130912; CN 201490001041 U 20140826; EP 14761522 A 20140826; JP 2016600088 U 20140826; US 2014052604 W 20140826