EP 3052915 A1 20160810 - MEMS CHIP, MEASURING ELEMENT AND PRESSURE SENSOR FOR MEASURING A PRESSURE
Title (en)
MEMS CHIP, MEASURING ELEMENT AND PRESSURE SENSOR FOR MEASURING A PRESSURE
Title (de)
MEMS-CHIP, MESSELEMENT UND DRUCKSENSOR ZUM MESSEN EINES DRUCKS
Title (fr)
PUCE MEMS, ÉLÉMENT DE MESURE ET CAPTEUR DE PRESSION PERMETTANT DE MESURER UNE PRESSION
Publication
Application
Priority
- CH 16992013 A 20131003
- CH 2014000142 W 20141002
Abstract (en)
[origin: WO2015048916A1] Micro-electro-mechanical system chip (MEMS chip) for measuring a pressure in a pressure space (D), comprising a MEMS substrate (30) and a carrier substrate (31) which are bonded to one another in a two-dimensional manner, wherein the MEMS chip (3) is in the form of a rod and has a measuring region (4) with electromechanical measuring means, then a bushing region (11), then a contact-making region (6) which is connected to the measuring region (4) via lines (8) and has contacts (16), and wherein the MEMS chip (3) in the bushing region (11) is suitable for pressure-tight arrangement in a bushing. According to the invention, the electromechanical measuring means are configured in such a manner that the MEMS substrate (30) has a cavity (5) forming a blind hole, the edge of which forms a membrane (7) in the MEMS substrate (30), and a measuring bridge (19) comprising piezoresistive elements (2) on that side of this membrane (7) which faces away from the cavity (5). The MEMS substrate (30) is bonded to the carrier substrate (31) with the side of the cavity (5) facing the carrier substrate (31), with the result that the carrier substrate (31) forms a bottom wall (50) of the cavity (5) formed under the membrane (7).
IPC 8 full level
G01L 9/00 (2006.01); G01L 19/06 (2006.01); G01L 19/14 (2006.01)
CPC (source: EP KR US)
G01L 9/0005 (2013.01 - KR); G01L 9/0045 (2013.01 - EP KR US); G01L 9/005 (2013.01 - EP US); G01L 9/0054 (2013.01 - US); G01L 19/0627 (2013.01 - EP KR US); G01L 19/147 (2013.01 - EP KR US)
Citation (search report)
See references of WO 2015048916A1
Citation (examination)
US 2002073533 A1 20020620 - PARK KYONG M [US]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
WO 2015048916 A1 20150409; BR 112016006523 A2 20170801; CA 2924166 A1 20150409; CH 708708 A1 20150415; CN 105593657 A 20160518; EP 3052915 A1 20160810; JP 2016540192 A 20161222; JP 2019174478 A 20191010; JP 6655211 B2 20200226; KR 20160065109 A 20160608; MX 2016004234 A 20161007; MX 360473 B 20181105; US 2016231189 A1 20160811; US 9927316 B2 20180327
DOCDB simple family (application)
CH 2014000142 W 20141002; BR 112016006523 A 20141002; CA 2924166 A 20141002; CH 16992013 A 20131003; CN 201480054869 A 20141002; EP 14789767 A 20141002; JP 2016519887 A 20141002; JP 2019097258 A 20190524; KR 20167008702 A 20141002; MX 2016004234 A 20141002; US 201415024482 A 20141002