EP 3053703 A4 20170726 - POLISHING DEVICE AND POLISHING METHOD
Title (en)
POLISHING DEVICE AND POLISHING METHOD
Title (de)
POLIERVORRICHTUNG UND POLIERVERFAHREN
Title (fr)
DISPOSITIF DE POLISSAGE ET PROCÉDÉ DE POLISSAGE
Publication
Application
Priority
- JP 2013209602 A 20131004
- JP 2014076360 W 20141002
Abstract (en)
[origin: EP3053703A1] It is an objective of the present invention to provide a polishing device and a polishing method that allows for polishing of workpieces having various contours. The polishing device includes a motor movement mechanism (33) and a second motor (30) that rotates a workpiece (K). The motor movement mechanism (33) moves the workpiece (K) in a direction tangential to a radially outer circumferential surface of a polishing member (10) and moves the workpiece (K) in a direction orthogonal to a rotational axis of the polishing member (10).
IPC 8 full level
B24B 9/00 (2006.01); B24B 9/10 (2006.01); B24B 19/08 (2006.01)
CPC (source: EP KR US)
B24B 9/107 (2013.01 - EP); B24B 19/02 (2013.01 - EP KR US); B24B 19/08 (2013.01 - EP KR US); B24B 41/002 (2013.01 - EP US); B24B 47/02 (2013.01 - KR)
Citation (search report)
- [X] US 4667443 A 19870526 - SAKURAI KAORU [JP], et al
- [A] EP 2537634 A1 20121226 - WENDT GMBH [DE]
- See references of WO 2015050186A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 3053703 A1 20160810; EP 3053703 A4 20170726; CN 105658377 A 20160608; JP 2018001406 A 20180111; JP WO2015050186 A1 20170309; KR 20160067106 A 20160613; TW 201529224 A 20150801; US 2016236314 A1 20160818; WO 2015050186 A1 20150409
DOCDB simple family (application)
EP 14851309 A 20141002; CN 201480054424 A 20141002; JP 2014076360 W 20141002; JP 2015540534 A 20141002; JP 2017196150 A 20171006; KR 20167008523 A 20141002; TW 103134429 A 20141002; US 201415026089 A 20141002