EP 3060688 A1 20160831 - THERMAL METHOD AND DEVICE FOR LOCALIZED STRENGTHENING OF THE EDGE LAYER ON A THICK-WALLED COMPONENT
Title (en)
THERMAL METHOD AND DEVICE FOR LOCALIZED STRENGTHENING OF THE EDGE LAYER ON A THICK-WALLED COMPONENT
Title (de)
THERMISCHES VERFAHREN UND VORRICHTUNG ZUR LOKALEN FESTIGKEITSSTEIGERUNG DER RANDSCHICHT BEI EINEM DICKWANDIGEN BAUTEIL
Title (fr)
PROCÉDÉ THERMIQUE ET DISPOSITIF POUR AUGMENTER LOCALEMENT LA SOLIDITÉ DE LA COUCHE MARGINALE D'UN ÉLÉMENT STRUCTURAL À PAROI ÉPAISSE
Publication
Application
Priority
- DE 102013221397 A 20131022
- EP 2014071760 W 20141010
Abstract (en)
[origin: WO2015058977A1] The invention relates to a thermal method and a device for localized strengthening of the edge layer (P1) of a continuous internal geometry (2) that is exposed to high pressure, of a thick-walled component (1) consisting of a martensitic temperable steel material, characterized by the following method steps: - Heating the entire component (1) to a temperature of between 820 to 1050 ºC, - Localized quenching in the region of the internal geometry (2) of the component to a temperature of between 150 and 450°, - Slow cooling of the component (1) from the region of the internal geometry (2) to the outer casing region (P2) at a temperature gradient of 1 to 100 ºC per second until a temperature equilibrium is reached, - Final quenching of the component (1) to ambient temperature.
IPC 8 full level
C21D 9/00 (2006.01); C21D 9/14 (2006.01); C21D 11/00 (2006.01)
CPC (source: EP)
C21D 9/0068 (2013.01); C21D 9/14 (2013.01); C21D 11/005 (2013.01); C21D 1/18 (2013.01); C21D 1/19 (2013.01); C21D 1/667 (2013.01); C21D 9/08 (2013.01); C21D 2221/10 (2013.01)
Citation (search report)
See references of WO 2015058977A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DE 102013221397 A1 20150423; CN 105658823 A 20160608; CN 105658823 B 20181009; EP 3060688 A1 20160831; WO 2015058977 A1 20150430
DOCDB simple family (application)
DE 102013221397 A 20131022; CN 201480057831 A 20141010; EP 14789199 A 20141010; EP 2014071760 W 20141010