EP 3063308 A4 20180404 - SHAPE MEMORY ALLOY CONDUCTOR RESISTS PLASTIC DEFORMATION
Title (en)
SHAPE MEMORY ALLOY CONDUCTOR RESISTS PLASTIC DEFORMATION
Title (de)
FORMGEDÄCHTNISLEGIERUNGSLEITER MIT BESTÄNDIGKEIT GEGENÜBER PLASTISCHER VERFORMUNG
Title (fr)
CONDUCTEUR D'ALLIAGE À MÉMOIRE DE FORME RÉSISTANT À LA DÉFORMATION PLASTIQUE
Publication
Application
Priority
- US 201361898854 P 20131101
- US 2014063670 W 20141103
Abstract (en)
[origin: WO2015066603A1] A conductor that resists plastic deformation is provided for an electronic signal-carrying or electric power-carrying cable, cable assembly, or device. The conducting element itself has favorable mechanical properties and therefore combines plastic deformation resistance with conductance. In one embodiment, the superelastic conductor is fabricated using a shape memory alloy such that the transformation temperature of the superelastic conductor is set outside the useful operating range of the conductor. In another embodiment, the conductor is fabricated using a shape memory alloy that is nominally in a martensitic phase under stress free conditions. In both embodiments, the conductor microstructures are able to accommodate externally applied strain, bending, deformation, or other external displacement through mechanisms which do not involve plastic deformation.
IPC 8 full level
C22F 1/00 (2006.01); A61L 31/14 (2006.01); F03G 7/06 (2006.01)
CPC (source: EP US)
A61L 31/022 (2013.01 - EP US); A61L 31/14 (2013.01 - EP US); C22C 5/02 (2013.01 - EP US); C22C 9/01 (2013.01 - EP US); C22C 9/02 (2013.01 - EP US); C22C 9/04 (2013.01 - EP US); C22C 20/00 (2013.01 - EP US); C22C 22/00 (2013.01 - EP US); C22C 28/00 (2013.01 - EP US); C22C 30/02 (2013.01 - EP US); C22C 30/04 (2013.01 - EP US); C22C 30/06 (2013.01 - EP US); C22C 38/002 (2013.01 - EP US); C22C 38/02 (2013.01 - EP US); C22C 38/04 (2013.01 - EP US); C22C 38/105 (2013.01 - EP US); C22C 38/12 (2013.01 - EP US); C22C 38/14 (2013.01 - EP US); C22C 38/34 (2013.01 - EP US); C22C 38/58 (2013.01 - EP US); C22F 1/006 (2013.01 - EP US); F03G 7/065 (2021.08 - EP US); H01B 1/02 (2013.01 - EP US); H01B 7/041 (2013.01 - US); H01B 7/40 (2013.01 - EP); A61L 2400/16 (2013.01 - EP US); C21D 2201/01 (2013.01 - EP US); C21D 2211/001 (2013.01 - EP US); C21D 2211/008 (2013.01 - EP US); H01B 7/0009 (2013.01 - EP); H01B 7/1805 (2013.01 - US); H04R 1/1033 (2013.01 - EP US); H04R 5/033 (2013.01 - EP US)
Citation (search report)
- [XAI] US 6329069 B1 20011211 - AZIZI GHOLAM REZA ZADNO [US], et al
- [XI] US 5611874 A 19970318 - ZADNO-AZIZI GHOLAM R [US], et al
- [XI] JP 2000169920 A 20000620 - ISHIDA KIYOHITO, et al
- [XI] EP 0778590 A2 19970611 - GORE & ASS [US]
- [X] JP H076635 A 19950110 - SONY CORP
- [X] US 2010104126 A1 20100429 - GREENE ANDREA MARTINA [US]
- [A] WEIMIN HUANG: "Shape memory alloys and their application to actuators for deployable structures", 31 March 1998 (1998-03-31), XP055415939, Retrieved from the Internet <URL:http://www3.ntu.edu.sg/home/mwmhuang/cambridge/Phd2side.pdf> [retrieved on 20171016]
- See references of WO 2015066603A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2015066603 A1 20150507; EP 3063308 A1 20160907; EP 3063308 A4 20180404; JP 2016539488 A 20161215; US 2016265093 A1 20160915
DOCDB simple family (application)
US 2014063670 W 20141103; EP 14857570 A 20141103; JP 2016552434 A 20141103; US 201415033223 A 20141103