Global Patent Index - EP 3064827 B1

EP 3064827 B1 20190508 - ARRANGEMENT FOR MOUNTING A LED MODULE ON A SURFACE OF A COOLING BODY AND LED ASSEMBLY

Title (en)

ARRANGEMENT FOR MOUNTING A LED MODULE ON A SURFACE OF A COOLING BODY AND LED ASSEMBLY

Title (de)

ANORDNUNG ZUR MONTAGE EINES LED-MODULS AUF EINER OBERFLÄCHE EINES KÜHLKÖRPERS SOWIE LED-ANORDNUNG

Title (fr)

ARRANGEMENT D'UN MONTAGE D'UN MODULE LED SUR UNE SURFACE D'UN CORPS DE REFROIDISSEMENT ET MONTAGE LED

Publication

EP 3064827 B1 20190508 (DE)

Application

EP 16158385 A 20160303

Priority

DE 202015101026 U 20150304

IPC 8 full level

F21V 17/00 (2006.01)

CPC (source: EP US)

F21V 7/06 (2013.01 - EP); F21V 17/005 (2013.01 - EP); F21V 17/12 (2013.01 - EP US); F21V 29/70 (2015.01 - EP); F21Y 2115/10 (2016.07 - EP US)

Citation (examination)

US 2013051009 A1 20130228 - ZADEREJ VICTOR [US], et al

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

DE 202015101026 U1 20160607; EP 3064827 A1 20160907; EP 3064827 B1 20190508

DOCDB simple family (application)

DE 202015101026 U 20150304; EP 16158385 A 20160303