EP 3066722 B1 20190703 - ELECTRICAL CONNECTION ARRANGEMENT
Title (en)
ELECTRICAL CONNECTION ARRANGEMENT
Title (de)
ELEKTRISCHE VERBINDUNGSANORDNUNG
Title (fr)
ENSEMBLE DE LIAISON ÉLECTRIQUE
Publication
Application
Priority
- DE 102013018851 A 20131109
- EP 2014002849 W 20141022
Abstract (en)
[origin: WO2015067347A1] The invention relates to a connection arrangement (10) for electrically connecting at least one sensor (12) or actuator to at least one conductor track (22) on a printed circuit board (24), wherein the at least one sensor (12) or actuator has at least one compression spring (18) for electrically conductive connection, and the at least one compression spring (18) is arranged between the at least one sensor (12) or actuator and the printed circuit board (24) so as to have an initial mechanical stress. According to the invention, this connection arrangement (10) has provision for a contact end section (36) – facing the printed circuit board (24) – of the at least one compression spring (18) to ensure reliable electrical connection by abutting a contact plate (20, 70, 80, 90) that is electrically conductively connected to the conductor track (22). As a result, the connection arrangement (10) achieves a high level of electrical contact reliability and has outstanding resistance towards corrosion processes of all kinds, particularly towards environment-related chemical corrosion processes and frictionally corrosive processes. Furthermore, the connection arrangement (10) can also be used without difficulty in the event of parallel use of press-fit technology.
IPC 8 full level
H01R 12/57 (2011.01); F16K 31/00 (2006.01); G01L 19/00 (2006.01); H01F 7/06 (2006.01); H01R 12/70 (2011.01); H01R 13/24 (2006.01); H01R 13/33 (2006.01); H05K 7/10 (2006.01)
CPC (source: EP US)
H01R 12/57 (2013.01 - EP US); H01R 12/7076 (2013.01 - EP US); H01R 12/718 (2013.01 - US); H01R 13/2421 (2013.01 - EP US); H01R 13/33 (2013.01 - EP US); H01R 12/707 (2013.01 - EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
DE 102013018851 A1 20150513; CN 105706308 A 20160622; CN 105706308 B 20200724; EP 3066722 A1 20160914; EP 3066722 B1 20190703; JP 2016535921 A 20161117; JP 6554097 B2 20190731; US 2016276770 A1 20160922; US 9634416 B2 20170425; WO 2015067347 A1 20150514
DOCDB simple family (application)
DE 102013018851 A 20131109; CN 201480061300 A 20141022; EP 14789794 A 20141022; EP 2014002849 W 20141022; JP 2016525545 A 20141022; US 201415028995 A 20141022