Global Patent Index - EP 3072985 A1

EP 3072985 A1 20160928 - AG-FREE AL-CU-MG-LI ALLOY

Title (en)

AG-FREE AL-CU-MG-LI ALLOY

Title (de)

AG-FREIE AL-CU-MG-LI-LEGIERUNG

Title (fr)

ALLIAGE D' AL-CU-MG-LI EXEMPT D'AG

Publication

EP 3072985 A1 20160928 (DE)

Application

EP 15161222 A 20150327

Priority

EP 15161222 A 20150327

Abstract (de)

Beschrieben ist eine Ag-freie Al-CuMg-Li-Legierung mit 3,5 - 4,5 Gew.-% Cu, 0,8 - 1,3 Gew.-% Li, 0,2 - 0,8 Gew.-% Mg, 0,1 - 0,4 Gew.-% Mn, 0,05 - 0,2 Gew.-% Zr, bis zu 0,1 Gew.-% Ti, wobei das Ti als TiB 2 oder TiC vorliegt, Rest Al nebst unvermeidbaren Verunreinigungen von gesamt max. 0,15 Gew.-%.

IPC 8 full level

C22C 21/16 (2006.01); C22F 1/057 (2006.01)

CPC (source: EP)

C22C 21/16 (2013.01); C22F 1/057 (2013.01)

Citation (search report)

  • [A] CHEN ZHONGWEI ET AL: "Combinative hardening effects of precipitation in a commercial aged Al-Cu-Li", MATERIALS SCIENCE AND ENGINEERING A: STRUCTURAL MATERIALS: PROPERTIES, MICROSTRUCTURES AND PROCESSING, vol. 588, 9 December 2013 (2013-12-09), pages 59 - 64, XP028758655, ISSN: 0921-5093, DOI: 10.1016/J.MSEA.2013.09.016
  • [A] HUANG B P ET AL: "Independent and combined roles of trace Mg and Ag additions in properties precipitation process and precipitation kinetics of Al-Cu-Li-(Mg)-(Ag)-Zr-Ti alloys", ACTA MATERIALIA, ELSEVIER, OXFORD, GB, vol. 46, no. 12, 24 July 1998 (1998-07-24), pages 4381 - 4393, XP027395678, ISSN: 1359-6454, [retrieved on 19980724]

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

EP 3072985 A1 20160928; EP 3072985 B1 20170705; EP 3072985 B2 20200826; ES 2642730 T3 20171117; ES 2642730 T5 20210609

DOCDB simple family (application)

EP 15161222 A 20150327; ES 15161222 T 20150327