EP 3081610 B1 20210428 - CONDUCTIVE ADHESIVE FILM
Title (en)
CONDUCTIVE ADHESIVE FILM
Title (de)
LEITFÄHIGE HAFTFOLIE
Title (fr)
FILM ADHÉSIF CONDUCTEUR
Publication
Application
Priority
- JP 2014176359 A 20140829
- JP 2015072709 W 20150810
Abstract (en)
[origin: EP3081610A1] An adhesive film that shows excellent heat resistance while showing excellent stress relaxation property, which further shows high conductivity that enables application to rear-side electrodes for power semiconductors without the use of expensive precious metals such as silver, which also shows sufficient adhesive strength without protruding from the device, and a method for processing semiconductors using the same, are provided. In particular, a conductive adhesive film, which comprises two or more types of metal particles including at least Cu and a polymer that has a polydimethylsiloxane structure, is provided. Further, a dicing die bonding film, which is obtained by laminating a dicing tape on said conductive adhesive film, as well as a method for processing semiconductor wafers using said adhesive film and said dicing die bonding film, are provided.
IPC 8 full level
C09J 7/10 (2018.01); C09J 9/02 (2006.01); C09J 183/04 (2006.01); H01L 21/52 (2006.01)
CPC (source: EP KR US)
C08K 3/08 (2013.01 - KR); C09J 7/10 (2017.12 - EP US); C09J 7/29 (2017.12 - KR); C09J 9/02 (2013.01 - EP KR US); C09J 11/04 (2013.01 - KR US); C09J 11/06 (2013.01 - KR US); C09J 183/04 (2013.01 - EP KR US); H01L 21/52 (2013.01 - EP KR US); H01L 21/6836 (2013.01 - KR US); H01L 21/78 (2013.01 - KR US); C08K 3/08 (2013.01 - EP US); C08K 2003/085 (2013.01 - EP KR US); C09J 2203/326 (2013.01 - EP KR); C09J 2483/00 (2013.01 - EP)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 3081610 A1 20161019; EP 3081610 A4 20170823; EP 3081610 B1 20210428; CN 106574151 A 20170419; CN 106574151 B 20200609; HU E054751 T2 20210928; JP 6382228 B2 20180829; JP WO2016031551 A1 20170427; KR 101914849 B1 20181102; KR 20170005430 A 20170113; MY 178733 A 20201020; PH 12017500373 A1 20170717; PH 12017500373 B1 20170717; SG 11201606126R A 20160929; US 2017152411 A1 20170601; WO 2016031551 A1 20160303
DOCDB simple family (application)
EP 15835176 A 20150810; CN 201580045111 A 20150810; HU E15835176 A 20150810; JP 2015072709 W 20150810; JP 2015557250 A 20150810; KR 20167033469 A 20150810; MY PI2016702285 A 20150810; PH 12017500373 A 20170228; SG 11201606126R A 20150810; US 201715428580 A 20170209